Business registries · firm from USPTO records

TEL FSI, INC.

USPTO only Derived from USPTO records only (patent assignees and trademark owners); FURP found no state registration, Form D, Form ADV, nonprofit, SEC or lobbying record with this name and place.

Place
3455 LYMAN BLVD., CHASKA, MN
Entity type
Corporation
State of organization
MN (as the owner states it in trademark filings)
Patents
33 granted 1988-06-27 to 2020-08-18
Trademarks
5, 4 live
Record
EXACT high confidence: USPTO records only: patent assignee and trademark owner with the same name (legal endings aside) and place
Source
USPTO: PVGPATDIS and TRCFECO2 (PVGPATDIS file of 2026-04-10, TRCFECO2 file of 2024-03-27); patent assignee and trademark owner with the same name (legal endings aside) and place

Patents

PatentTitleGrantedSource
US 10748789Systems and methods for treating substrates with cryogenic fluid mixtures2020-08-18PVGPATDIS, file of 2026-04-10
US 10748788System and method for monitoring treatment of microelectronic substrates with fluid sprays such as cryogenic fluid sprays2020-08-18PVGPATDIS, file of 2026-04-10
US 10625280Apparatus for spraying cryogenic fluids2020-04-21PVGPATDIS, file of 2026-04-10
US 10418270Wafer edge lift pin design for manufacturing a semiconductor device2019-09-17PVGPATDIS, file of 2026-04-10
US 10062596Systems and methods for treating substrates with cryogenic fluid mixtures2018-08-28PVGPATDIS, file of 2026-04-10
US 10020217Systems and methods for treating substrates with cryogenic fluid mixtures2018-07-10PVGPATDIS, file of 2026-04-10
US 10020207Apparatus and method for scanning an object through a fluid stream2018-07-10PVGPATDIS, file of 2026-04-10
US 10014191Systems and methods for treating substrates with cryogenic fluid mixtures2018-07-03PVGPATDIS, file of 2026-04-10
US 9982664Systems and methods for metering a dose volume of fluid used to treat microelectronic substrates2018-05-29PVGPATDIS, file of 2026-04-10
US 9911631Processing system and method for providing a heated etching solution2018-03-06PVGPATDIS, file of 2026-04-10
US 9887107Methodologies for rinsing tool surfaces in tools used to process microelectronic workpieces2018-02-06PVGPATDIS, file of 2026-04-10
US 9831107Processing system and method for providing a heated etching solution2017-11-28PVGPATDIS, file of 2026-04-10
US 9691628Process for silicon nitride removal selective to SiGex2017-06-27PVGPATDIS, file of 2026-04-10
US 9666456Method and apparatus for treating a workpiece with arrays of nozzles2017-05-30PVGPATDIS, file of 2026-04-10
US 9564378Detection of lost wafer from spinning chuck2017-02-07PVGPATDIS, file of 2026-04-10
US 9490138Method of substrate temperature control during high temperature wet processing2016-11-08PVGPATDIS, file of 2026-04-10
US 9412639Method of using separate wafer contacts during wafer processing2016-08-09PVGPATDIS, file of 2026-04-10
US 9412628Acid treatment strategies useful to fabricate microelectronic devices and precursors thereof2016-08-09PVGPATDIS, file of 2026-04-10
US 9299570Process for silicon nitride removal selective to SiGex2016-03-29PVGPATDIS, file of 2026-04-10
US 9263303Methodologies for rinsing tool surfaces in tools used to process microelectronic workpieces2016-02-16PVGPATDIS, file of 2026-04-10
US 9059104Process for selectively removing nitride from substrates2015-06-16PVGPATDIS, file of 2026-04-10
US 9039840Tools and methods for processing microelectronic workpieces using process chamber designs that easily transition between open and closed modes of operation2015-05-26PVGPATDIS, file of 2026-04-10
US 9017568Process for increasing the hydrophilicity of silicon surfaces following HF treatment2015-04-28PVGPATDIS, file of 2026-04-10
US 8978675Method and apparatus for treating a workpiece with arrays of nozzles2015-03-17PVGPATDIS, file of 2026-04-10
US 8967167Barrier structure and nozzle device for use in tools used to process microelectronic workpieces with one or more treatment fluids2015-03-03PVGPATDIS, file of 2026-04-10

The newest 25 of 33. All patents of this assignee

Trademarks

MarkSerialFiledStatusClassesSource
YIELDUP770938642007-01-29Registration cancelled007TRCFECO2, file of 2024-03-27
ORION770924542007-01-26Registered and renewed007TRCFECO2, file of 2024-03-27
ANTARES755167671998-07-10Registered and renewed007TRCFECO2, file of 2024-03-27
ZETA750523511996-02-02Registered and renewed009TRCFECO2, file of 2024-03-27
MERCURY737369321988-06-27Registered and renewed009TRTDXFAP, file of 2026-05-03

All marks of this owner

Sharing an address can mean a parent and subsidiary, a shared office or a registered agent; it isn’t proof of a connection.

Firms here are built from USPTO patent assignees (PatentsView) and trademark owners: one firm per name (legal endings aside) and state, or country outside the US. Matches to other records are by name and state: EXACT means the identical full name, FUZZY a looser match, with the confidence shown.