Patents

US 9039840 B2: Tools and methods for processing microelectronic workpieces using process chamber designs that easily transition between open and closed modes of operation

Granted
2015-05-26
Filed
2013-04-01 application 13854493
Type
Utility · 5 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Strategies for tool designs and their uses wherein the tools can operate in either closed or open modes of operation. The tools easily transition between open and closed modes on demand. According to one general strategy, environmentally controlled pathway(s) couple the ambient to one or more process chambers. Air amplification capabilities upstream from the process chamber(s) allow substantial flows of air to be introduced into the process chamber(s) on demand. Alternatively, the fluid pathways are easily closed, such as by simple valve actuation, to block egress to the ambient through these pathways. Alternative flows of nonambient fluids can then be introduced into the process chamber(s) via pathways that are at least partially in common with the pathways used for ambient air introduction. In other strategies, gap(s) between moveable components are sealed at least with flowing gas curtains rather than by relying only upon direct physical contact for sealing.

Source: PVGPATDIS, file of 2026-04-10 (ipg150526.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
TEL FSI, INC. 34 patentsUS company or organizationChaska, MNPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Jeffrey M. LauerhaasWaconia, MN5PVGPATDIS, file of 2026-04-10
Jimmy D. CollinsAllen, TX11PVGPATDIS, file of 2026-04-10
Tracy A. GastWaconia, MN10PVGPATDIS, file of 2026-04-10
Alan D. RoseWylie, TX13PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
H01LSemiconductor devices not covered by class h10H01L21/67017PVGPATDIS, file of 2026-04-10
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h10H10P72/0402PVGPATDIS, file of 2026-04-10
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digestsY10S134/902PVGPATDIS, file of 2026-04-10
Y10TTechnical subjects covered by former us classificationY10T137/0363PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2020-07-30Correction
Conversion
TEL FSI, INC. signed 2019-12-31TEL MANUFACTURING AND ENGINEERING OF AMERICA, INC. CHASKA, MN53366/139PASDL, file of 2026-10-15
2015-01-30Merger
Merger and change of name
RB MERGER CORP. signed 2012-10-11
FSI INTERNATIONAL, INC. signed 2012-10-11
FSI INTERNATIONAL, INC. signed 2012-10-11
TEL FSI, INC. MINNEAPOLIS, MN34854/524PASDL, file of 2026-10-15
2015-01-30Assignment
Assignment of assignor's interest
LAUERHAAS, JEFFREY M. signed 2009-06-15
COLLINS, JIMMY D. signed 2009-06-21
GAST, TRACY A. signed 2009-06-17
ROSE, ALAN D. signed 2009-06-22
FSI INTERNATIONAL, INC. CHASKA, MN34854/128PASDL, file of 2026-10-15

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.