Patents
US 10625280 B2: Apparatus for spraying cryogenic fluids
- Granted
- 2020-04-21
- Filed
- 2017-08-18 application 15681105
- Type
- Utility · 20 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
Disclosed herein are systems and methods for treating the surface of a microelectronic substrate, and in particular, relate to an apparatus and method for scanning the microelectronic substrate through a cryogenic fluid mixture used to treat an exposed surface of the microelectronic substrate. In particular, an improved nozzle design used to expand the fluid mixture is disclosed herein. In one embodiment, the nozzle design incorporates a two nozzle pieces are combined to form a single nozzle design, in which the two pieces are slight misaligned to form a unique orifice design. In another embodiment, two pieces are combined and aligned along a common axis of the fluid conduit. However, an offset piece is inserted between the two pieces and has a hole that misaligned from the flow conduits of the two other pieces.
Source: PVGPATDIS, file of 2026-04-10 (ipg200421.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| TEL FSI, INC. 34 patents | US company or organization | Chaska, MN | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Edward Hanzlik | Shorewood, MN | 7 | PVGPATDIS, file of 2026-04-10 | |
| Brian D. Hansen | Carver, MN | 2 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| B05B | Spraying apparatus; atomising apparatus; nozzles | B05B1/34 | PVGPATDIS, file of 2026-04-10 |
| H01L | Semiconductor devices not covered by class h10 | H01L21/02043 | PVGPATDIS, file of 2026-04-10 |
| H10P | Generic processes or apparatus for the manufacture or treatment of devices covered by class h10 | H10P70/10 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2020-07-30 | Correction Conversion | TEL FSI, INC. signed 2019-12-31 | TEL MANUFACTURING AND ENGINEERING OF AMERICA, INC. CHASKA, MN | 53366/139 | PASDL, file of 2026-10-15 |
| 2018-08-03 | Assignment Assignment of assignor's interest | HANZLIK, EDWARD D. signed 2018-08-01 HANSEN, BRIAN D. signed 2018-08-01 | TEL FSI, INC. CHASKA, MN | 46548/462 | PASDL, file of 2026-10-15 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.