Patents
US 9831107 B2: Processing system and method for providing a heated etching solution
- Granted
- 2017-11-28
- Filed
- 2014-03-13 application 14209966
- Type
- Utility · 13 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A method and processing system are provided for independent temperature and hydration control for an etching solution used for treating a wafer in process chamber. The method includes circulating the etching solution in a circulation loop, maintaining the etching solution at a hydration setpoint by adding or removing water from the etching solution, maintaining the etching solution at a temperature setpoint that is below the boiling point of the etching solution in the circulation loop, and dispensing the etching solution into the process chamber for treating the wafer. In one embodiment, the dispensing includes dispensing the etching solution into a processing region proximate the wafer in the process chamber, introducing steam into an exterior region that is removed from the wafer in the process chamber, and treating the wafer with the etching solution and the steam.
Source: PVGPATDIS, file of 2026-04-10 (ipg171128.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| TEL FSI, INC. 34 patents | US company or organization | Chaska, MN | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Kevin L. Siefering | Excelsior, MN | 8 | PVGPATDIS, file of 2026-04-10 | |
| William P. Inhofer | Plymouth, MN | 5 | PVGPATDIS, file of 2026-04-10 | |
| David DeKraker | Burnsville, MN | 14 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H01L | Semiconductor devices not covered by class h10 | H01L21/67017 | PVGPATDIS, file of 2026-04-10 |
| H10P | Generic processes or apparatus for the manufacture or treatment of devices covered by class h10 | H10P72/0422 | PVGPATDIS, file of 2026-04-10 |
| G05B | Control or regulating systems in general; functional elements of such systems; monitoring or testing arrangements for such systems or elements | G05B19/418 | PVGPATDIS, file of 2026-04-10 |
| H10W | Generic packages, interconnections, connectors or other constructional details of devices covered by class h10 | H10W70/045 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2020-07-30 | Correction Conversion | TEL FSI, INC. signed 2019-12-31 | TEL MANUFACTURING AND ENGINEERING OF AMERICA, INC. CHASKA, MN | 53366/139 | PASDL, file of 2026-10-15 |
| 2014-04-17 | Assignment Assignment of assignor's interest | DEKRAKER, DAVID signed 2014-04-14 | TEL FSI, INC. CHASKA, MN | 32698/771 | ECORSEXC, file of 2026-09-25 |
| 2014-04-04 | Assignment Assignment of assignor's interest | INHOFER, WILLIAM P. signed 2014-03-13 SIEFERING, KEVIN L. signed 2014-03-13 | TEL FSI, INC. CHASKA, MN | 32602/992 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.