Patents

US 10748788 B2: System and method for monitoring treatment of microelectronic substrates with fluid sprays such as cryogenic fluid sprays

Granted
2020-08-18
Filed
2018-03-15 application 15922203
Type
Utility · 19 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A system and method for treating a substrate is described. In particular, the system and method for treating a substrate include techniques for removing particles from the surface of a microelectronic substrate. The system includes: a vacuum process chamber; a substrate stage for supporting a microelectronic substrate within the vacuum process chamber; a cryogenic fluid supply system that can provide a fluid or fluid mixture through one or more nozzles arranged within the vacuum process chamber to inject a fluid spray into the process chamber in a direction towards an upper surface of the microelectronic substrate; and a process monitoring system coupled to the vacuum process chamber, and arranged to collect fluid spray data corresponding to at least one measured attribute of the injected fluid spray downstream of an exit of the one or more nozzles.

Source: PVGPATDIS, file of 2026-04-10 (ipg200818.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
TEL FSI, INC. 34 patentsUS company or organizationChaska, MNPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Brent SchwabBurnsville, MN1PVGPATDIS, file of 2026-04-10
Chimaobi W. MbanasoChaska, MN8PVGPATDIS, file of 2026-04-10
Gregory P. ThomesChaska, MN3PVGPATDIS, file of 2026-04-10
Kevin RolfVictoria, MN1PVGPATDIS, file of 2026-04-10
Jeffrey M. LauerhaasWaconia, MN5PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
H01LSemiconductor devices not covered by class h10H01L21/67051PVGPATDIS, file of 2026-04-10
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h10H10P72/0414PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2020-07-30Correction
Conversion
TEL FSI, INC. signed 2019-12-31TEL MANUFACTURING AND ENGINEERING OF AMERICA, INC. CHASKA, MN53366/139PASDL, file of 2026-10-15
2018-06-21Assignment
Assignment of assignor's interest
SCHWAB, BRENT D. signed 2018-06-12
THOMES, GREGORY P. signed 2018-06-12
ROLF, KEVIN signed 2018-06-13
LAUERHAAS, JEFFREY M. signed 2018-06-19
MBANASO, CHIMAOBI W. signed 2018-06-19
TEL FSI, INC. CHASKA, MN46154/404ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.