Patents
US 10014191 B2: Systems and methods for treating substrates with cryogenic fluid mixtures
- Granted
- 2018-07-03
- Filed
- 2016-06-29 application 15197450
- Type
- Utility · 15 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
Disclosed herein are systems and methods for treating the surface of a microelectronic substrate, and in particular, relate to an apparatus and method for scanning the microelectronic substrate through a cryogenic fluid mixture used to treat an exposed surface of the microelectronic substrate. The fluid mixture may be expanded through a nozzle to form an aerosol spray or gas cluster jet (GCJ) spray may impinge the microelectronic substrate and remove particles from the microelectronic substrate's surface. In one embodiment, the fluid mixture may be maintained to prevent liquid formation within the fluid mixture prior to passing the fluid mixture through the nozzle. The fluid mixture may include nitrogen, argon, helium, neon, xenon, krypton, carbon dioxide, or any combination thereof.
Source: PVGPATDIS, file of 2026-04-10 (ipg180703.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| TEL FSI, INC. 34 patents | US company or organization | Chaska, MN | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Chimaobi W. Mbanaso | Chaska, MN | 8 | PVGPATDIS, file of 2026-04-10 | |
| Jeffery W. Butterbaugh | Eden Prairie, MN | 14 | PVGPATDIS, file of 2026-04-10 | |
| David S. Becker | Excelsior, MN | 10 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H01L | Semiconductor devices not covered by class h10 | H01L21/67051 | PVGPATDIS, file of 2026-04-10 |
| H10P | Generic processes or apparatus for the manufacture or treatment of devices covered by class h10 | H10P72/0414 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2020-07-30 | Correction Conversion | TEL FSI, INC. signed 2019-12-31 | TEL MANUFACTURING AND ENGINEERING OF AMERICA, INC. CHASKA, MN | 53366/139 | PASDL, file of 2026-10-15 |
| 2016-08-03 | Assignment Assignment of assignor's interest | MBANASO, CHIMAOBI W. signed 2016-07-11 BUTTERBAUGH, JEFFERY W. signed 2016-07-01 BECKER, DAVID SCOTT signed 2016-07-12 | TEL FSI, INC. CHASKA, MN | 39335/210 | PASDL, file of 2026-10-15 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.