Patents
US D1069711 S1: Resistor
- Granted
- 2025-04-08
- Filed
- 2021-05-11 application 29783076
- Type
- Design · 1 claim
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
Not reported
Source: PVGPATDIS, file of 2026-04-10 (ipg250408.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Vishay Dale Electronics, LLC 74 patents | US company or organization | Columbus, NE | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Todd L. Wyatt | Columbus, NE | 29 | PVGPATDIS, file of 2026-04-10 | |
| Tom Bertsch | Norfolk, NE | 3 | PVGPATDIS, file of 2026-04-10 | |
| Joshua H. Johnson | Columbus, NE | 18 | PVGPATDIS, file of 2026-04-10 | |
| Aaron Krause | Columbus, NE | 3 | PVGPATDIS, file of 2026-04-10 | |
| Sara Vo | Columbus, NE | 3 | PVGPATDIS, file of 2026-04-10 | |
| Darin Glenn | Columbus, NE | 9 | PVGPATDIS, file of 2026-04-10 |
CPC categories
No CPC categories reported.
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2025-09-16 | Security interest Security interest Security interest | VISHAY DALE ELECTRONICS, INC. (N/K/A VISHAY DALE ELECTRONICS, LLC) signed 2025-09-08 VISHAY-SILICONIX (N/K/A SILICONIX INCORPORATED) signed 2025-09-08 VISHAY GENERAL SEMICONDUCTOR INC. (N/K/A VISHAY GSI, INC.) signed 2025-09-08 VISHAY GENERAL SEMICONDUCTOR, LLC (N/K/A VISHAY GSI, INC.) signed 2025-09-08 VISHAY INTERTECHNOLOGY, INC. signed 2025-09-08 | JPMORGAN CHASE BANK, N.A. CHICAGO, IL | 72272/193 | PASDL, file of 2026-10-15 |
| 2021-05-11 | Assignment Assignment of assignor's interest | BERTSCH, TOM signed 2021-05-06 JOHNSON, JOSHUA signed 2021-05-06 KRAUSE, AARON signed 2021-05-06 VO, SARA signed 2021-05-06 WYATT, TODD signed 2021-05-06 GLENN, DARIN signed 2021-05-07 | VISHAY DALE ELECTRONICS, LLC COLUMBUS, NE | 56200/589 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.