Patents

US 9991152 B2: Wafer-handling end effectors with wafer-contacting surfaces and sealing structures

Granted
2018-06-05
Filed
2015-02-25 application 14631131
Type
Utility · 22 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Wafer-handling end effectors and semiconductor manufacturing devices that include and/or are utilized with wafer-handling end effectors are disclosed herein. The end effectors include an end effector body and a plurality of wafer-contacting surfaces that is supported by the end effector body and configured to form an at least partially face-to-face contact with a wafer. The end effectors further include a vacuum distribution manifold that extends between a robot-proximal end of the end effector body and the plurality of wafer-contacting surfaces. The end effectors also include a plurality of vacuum openings that is defined within the plurality of wafer-contacting surfaces and extends between the plurality of wafer-contacting surfaces and the vacuum distribution manifold. The end effectors further include a plurality of sealing structures each of which is associated with a respective one of the plurality of wafer-contacting surfaces.

Source: PVGPATDIS, file of 2026-04-10 (ipg180605.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Cascade Microtech, Inc. 96 patentsUS company or organizationBeaverton, ORCASCADE MICROTECH INC SEC filer EXACT medium confidence: identical full name, one of each nationallyPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Robbie Ingram-GoblePortland, OR7PVGPATDIS, file of 2026-04-10
Michael E. SimmonsColton, OR13PVGPATDIS, file of 2026-04-10
Philip WolfBeaverton, OR10PVGPATDIS, file of 2026-04-10
Ryan GarrisonBeaverton, OR4PVGPATDIS, file of 2026-04-10
Christopher StormHillsboro, OR5PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
H01LSemiconductor devices not covered by class h10H01L21/6838PVGPATDIS, file of 2026-04-10
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h10H10P72/78PVGPATDIS, file of 2026-04-10
B25JManipulators; chambers provided with manipulation devicesB25J11/0095PVGPATDIS, file of 2026-04-10
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digestsY10S901/40PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2025-08-07Release of security interest
Release of security interest
HSBC BANK USA, NATIONAL ASSOCIATION signed 2025-08-06FORMFACTOR, INC. LIVERMORE, CA72853/1PASDL, file of 2026-10-15
2025-07-29Security interest Security interest
Security interest
FORMFACTOR, INC. signed 2025-07-29WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT SAN ANTONIO, TX72263/272PASDL, file of 2026-10-25
2021-09-01Assignment
Assignment of assignor's interest
FORMFACTOR BEAVERTON, INC. signed 2021-08-26FORMFACTOR, INC. LIVERMORE, CA57393/609PASDL, file of 2026-10-15
2018-07-18Name change
Change of name
CASCADE MICROTECH, INC. signed 2018-05-14FORMFACTOR BEAVERTON, INC. BEAVERTON, OR46573/664PASDL, file of 2026-10-15
2016-07-12Security interest Security interest
Security interest in united states patents and trademarks
FORMFACTOR, INC. signed 2016-06-24
ASTRIA SEMICONDUCTOR HOLDINGS, INC. signed 2016-06-24
CASCADE MICROTECH, INC. signed 2016-06-24
MICRO-PROBE INCORPORATED signed 2016-06-24
HSBC BANK USA, NATIONAL ASSOCIATION SAN FRANCISCO, CA39184/280PASDL, file of 2026-10-15
2015-02-25Assignment
Assignment of assignor's interest
INGRAM-GOBLE, ROBBIE signed 2015-02-10
SIMMONS, MICHAEL E. signed 2015-02-10
WOLF, PHILIP signed 2015-02-10
GARRISON, RYAN signed 2015-02-11
STORM, CHRISTOPHER signed 2015-02-11
CASCADE MICROTECH, INC. BEAVERTON, OR35028/135PASDL, file of 2026-10-15

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.