Patents

US 9970822 B2: Temperature monitoring device for workflow monitoring system

Granted
2018-05-15
Filed
2015-01-09 application 14593698
Type
Utility · 10 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A host device and temperature monitoring device (TMD) integrated assembly that can automatically collect temperature data and interface with a workflow management system. The TMD is provided in a portable housing and incorporates one or more temperature sensors, such as a physical probe, infrared sensor, or RFID transceiver, along with an interface for communicating via a wired connection with a host device that has been programmed with temperature management tasks. The TMD may be used to automatically collect temperatures and provide the data to the host for monitoring and tracking as part of a comprehensive workflow management system that includes food safety monitoring and compliance programs.

Source: PVGPATDIS, file of 2026-04-10 (ipg180515.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
PAR TECHNOLOGY CORPORATION 17 patentsUS company or organizationNew Hartford, NYPAR TECHNOLOGY CORP SEC filer FUZZY low confidence: same name (legal endings aside), one of each nationallyPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Rahi RoshandelPlattsburgh, NY1PVGPATDIS, file of 2026-04-10
Brian JohnsonNew Hartford, NY66PVGPATDIS, file of 2026-04-10
William DenalePlattsburgh, NY1PVGPATDIS, file of 2026-04-10
Bernard S. BakerHerkimer, NY1PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light; colorimetry; radiation pyrometryG01J5/0265PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2021-09-22Release of security interest
Release of security interest
OWL ROCK FIRST LIEN MASTER FUND, L.P. signed 2021-09-17PAR TECHNOLOGY CORPORATION NEW HARTFORD, NY
PARTECH, INC. NEW HARTFORD, NY
PUNCHH INC. SAN MATEO, CA
57564/591PASDL, file of 2026-10-15
2021-04-08Security interest Security interest
Security interest
PAR TECHNOLOGY CORPORATION signed 2021-04-08
PARTECH, INC. signed 2021-04-08
PUNCHH INC. signed 2021-04-08
OWL ROCK FIRST LIEN MASTER FUND, L.P., AS COLLATERAL AGENT NEW YORK, NY55870/710PASDL, file of 2026-10-15
2019-04-22Release of security interest
Release of security interest recorded on june 5, 2018 at reel/frame 045991/0151
CITIZENS BANK, N.A. signed 2019-04-15PAR GOVERNMENT SYSTEMS CORPORATION NEW HARTFORD, NY
PAR TECHNOLOGY CORPORATION NEW HARTFORD, NY
50164/843ECORSEXC, file of 2026-09-25
2018-06-28Release of security interest
Release of security interest
JPMORGAN CHASE BANK, N.A. signed 2018-06-08AUSABLE SOLUTIONS, INC. NEW HARTFORD, NY
PAR GOVERNMENT SYSTEMS CORPORATION NEW HARTFORD, NY
PAR LOGISTICS MANAGEMENT SYSTEMS CORPORATION NEW HARTFORD, NY
PAR SPRINGER-MILLER SYSTEMS, INC. NEW HARTFORD, NY
PAR TECHNOLOGY CORPORATION NEW HARTFORD, NY
PAR-SIVA CORPORATION NEW HARTFORD, NY
PARTECH, INC. NEW HARTFORD, NY
ROME RESEARCH CORPORATION NEW HARTFORD, NY
SPRINGER-MILLER INTERNATIONAL, LLC NEW HARTFORD, NY
46455/658ECORSEXC, file of 2026-09-25
2018-06-05Security interest Security interest
Security interest
PAR GOVERNMENT SYSTEMS CORPORATION signed 2018-06-05
PAR TECHNOLOGY CORPORATION signed 2018-06-05
CITIZENS BANK, N.A. ROCHESTER, NY45991/151ECORSEXC, file of 2026-09-25
2016-12-01Security interest Security interest
Security interest
PAR TECHNOLOGY CORPORATION signed 2016-11-29JPMORGAN CHASE BANK, N.A. CHICAGO, IL40479/467ECORSEXC, file of 2026-09-25
2016-01-12Assignment
Assignment of assignor's interest
BAKER, BERNARD signed 2015-01-12
DENALE, WILLIAM signed 2015-01-12
JOHNSON, BRIAN signed 2015-01-12
ROSHANDEL, RAHI signed 2015-01-14
PAR TECHNOLOGY CORPORATION NEW HARTFORD, NY37465/269ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.