Patents

US 9961277 B2: Infrared focal plane array heat spreaders

Granted
2018-05-01
Filed
2015-06-26 application 14751437
Type
Utility · 23 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

In one embodiment, an infrared (IR) sensor module includes an IR sensor assembly, including a substrate, a microbolometer array disposed on an upper surface of the substrate; and a cap disposed on the upper surface of the substrate and hermetically enclosing the microbolometer array. A base is disposed below the substrate, and a heat spreader having a generally planar portion is interposed between a lower surface of the substrate and an upper surface of the base. In some embodiments, the heat spreader can include a material having an anisotropic thermal conductivity, e.g., graphite.

Source: PVGPATDIS, file of 2026-04-10 (ipg180501.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
FLIR Systems, Inc. 370 patentsUS company or organizationWilsonville, ORFLIR SYSTEMS INC Form D issuer EXACT high confidence: identical full name and state
FLIR SYSTEMS INC SEC filer EXACT medium confidence: identical full name, one of each nationally
PVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Theodore R. HoelterGoleta, CA74PVGPATDIS, file of 2026-04-10
Mark NussmeierGoleta, CA30PVGPATDIS, file of 2026-04-10
Eric A. KurthLompoc, CA59PVGPATDIS, file of 2026-04-10
Nicholas HögastenLompoc, CA92PVGPATDIS, file of 2026-04-10
Katrin StrandemarRimbo, SE77PVGPATDIS, file of 2026-04-10
Pierre BoulangerGoleta, CA60PVGPATDIS, file of 2026-04-10
Barbara SharpLompoc, CA45PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light; colorimetry; radiation pyrometryG01J5/025PVGPATDIS, file of 2026-04-10
H04NPictorial communication, e.g. televisionH04N23/23PVGPATDIS, file of 2026-04-10
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiationH10F39/011PVGPATDIS, file of 2026-04-10
H01LSemiconductor devices not covered by class h10H01L2224/48091PVGPATDIS, file of 2026-04-10
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10H10W72/884PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2021-11-24Merger
Merger and change of name
FLIR SYSTEMS, INC. signed 2021-05-14
FIREWORK MERGER SUB II, LLC signed 2021-05-14
TELEDYNE FLIR, LLC THOUSAND OAKS, CA58830/871PASDL, file of 2026-10-15
2015-08-05Assignment
Assignment of assignor's interest
STRANDEMAR, KATRIN signed 2015-06-23
BOULANGER, PIERRE signed 2015-06-24
HOELTER, THEORDORE R. signed 2015-06-24
SHARP, BARBARA signed 2015-06-24
NUSSMEIER, MARK signed 2015-06-25
KURTH, ERIC A. signed 2015-06-26
HÖGASTEN, NICHOLAS signed 2015-07-29
FLIR SYSTEMS, INC. WILSONVILLE, OR36258/255ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.