Patents

US 9949377 B2: Electronic devices with internal moisture-resistant coatings

Granted
2018-04-17
Filed
2015-01-09 application 14593614
Type
Utility · 3 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A moisture-resistant electronic device includes at least one electronic component at least partially covered by a moisture-resistant coating. The moisture-resistant coating may be located within an interior of the electronic device. The moisture-resistant coating may cover only portions of a boundary of an internal space within the electronic device. A moisture-resistant coating may include one or more discernible boundaries, or seams, which may be located at or adjacent to locations where two or more components of the electronic device interface with each other. Assembly methods are also disclosed.

Source: PVGPATDIS, file of 2026-04-10 (ipg180417.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
HZO, Inc. 41 patentsUS company or organizationDraper, UTHZO, INC. Form D issuer EXACT high confidence: identical full name and statePVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Max SorensonCottonwood Heights, UT24PVGPATDIS, file of 2026-04-10
Blake StevensMorristown, NJ22PVGPATDIS, file of 2026-04-10
Alan RaeWilson, NY3PVGPATDIS, file of 2026-04-10
Marc ChasonSchaumburg, IL11PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
H05KPrinted circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical componentsH05K3/284PVGPATDIS, file of 2026-04-10
H01LSemiconductor devices not covered by class h10H01L2224/16225PVGPATDIS, file of 2026-04-10
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10H10W90/724PVGPATDIS, file of 2026-04-10
Y10TTechnical subjects covered by former us classificationY10T29/49002PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2023-06-05Security interest Security interest
Security interest
HZO, INC. signed 2023-06-05
HZO HONG KONG LIMITED signed 2023-06-05
CATHAY BANK EL MONTE, CA63861/25PASDL, file of 2026-10-05
2019-02-07Security interest Security interest
Security interest
HZO, INC. signed 2019-02-04CATHAY BANK EL MONTE, CA48284/626ECORSEXC, file of 2026-09-25
2018-01-03Security interest Security interest
Security interest
HZO, INC. signed 2017-12-27CATHAY BANK EL MONTE, CA44995/270ECORSEXC, file of 2026-09-25
2018-01-03Release of security interest
Release of security interest
PACIFIC WESTERN BANK signed 2017-12-29HZO, INC. DRAPER, UT44523/446ECORSEXC, file of 2026-09-25
2016-05-02Security interest Security interest
Security interest
HZO, INC. signed 2013-09-23PACIFIC WESTERN BANK (AS SUCCESSOR IN INTEREST BY MERGER TO SQUARE 1 BANK) DURHAM, NC38435/224ECORSEXC, file of 2026-09-25
2015-01-09Assignment
Assignment of assignor's interest
SORENSON, MAX signed 2012-06-14
STEVENS, BLAKE signed 2012-06-14
CHASON, MARC signed 2012-07-10
RAE, ALAN signed 2012-07-11
HZO, INC. DRAPER, UT34675/648ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.