Patents

US 9927703 B2: Layered polymer structures and methods

Granted
2018-03-27
Filed
2013-12-20 application 14653478
Type
Utility · 8 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

An optical assembly includes an optical device having an optical surface. The optical assembly further includes an encapsulant that substantially covers the optical surface. The encapsulant has a first layer (106) and a second layer (108). The first layer (106) has a first silicone-containing hot melt composition and a major surface (112). The second layer (108) has a second silicone-containing hot melt composition, the second layer (108) having a second major surface (110) in contact with the first major surface (112).

Source: PVGPATDIS, file of 2026-04-10 (ipg180327.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Dow Corning Corporation 429 patentsUS company or organizationMidland, MIPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Steven SwierMidland, MI57PVGPATDIS, file of 2026-04-10
Shin YoshidaIchihara, JP22PVGPATDIS, file of 2026-04-10
Masaaki YoshidaIchihara, JP20PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices; materials therefor; originals therefor; apparatus specially adapted therefor;G03F7/0007PVGPATDIS, file of 2026-04-10
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, formB32B27/06PVGPATDIS, file of 2026-04-10
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bondsC08G77/44PVGPATDIS, file of 2026-04-10
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredientsC08K5/56PVGPATDIS, file of 2026-04-10
C08LCompositions of macromolecular compoundsC08L83/00PVGPATDIS, file of 2026-04-10
H10HInorganic light-emitting semiconductor devices having potential barriersH10H20/853PVGPATDIS, file of 2026-04-10
H01LSemiconductor devices not covered by class h10H01L2224/48091PVGPATDIS, file of 2026-04-10
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10H10W72/01515PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2019-05-17Assignment
Assignment of assignor's interest
DOW CORNING TORAY CO., LTD. signed 2019-02-01DOW TORAY CO., LTD. SHINAGAWA-KU, TOKYO51322/925ECORSEXC, file of 2026-09-25
2018-03-07Name change
Change of name
DOW CORNING CORPORATION signed 2018-02-01DOW SILICONES CORPORATION MIDLAND, MI45515/548ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.