Patents

US 9848134 B2: Infrared imager with integrated metal layers

Granted
2017-12-19
Filed
2013-11-27 application 14092794
Type
Utility · 20 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Various techniques are provided for implementing, operating, and manufacturing infrared imaging devices using integrated circuits. In one example, a system includes a focal plane array (FPA) integrated circuit comprising an array of infrared sensors adapted to image a scene, a plurality of active circuit components, a first metal layer disposed above and connected to the circuit components, a second metal layer disposed above the first metal layer and connected to the first metal layer, and a third metal layer disposed above the second metal layer and below the infrared sensors. The third metal layer is connected to the second metal layer and the infrared sensors. The first, second, and third metal layers are the only metal layers of the FPA between the infrared sensors and the circuit components. The first, second, and third metal layers are adapted to route signals between the circuit components and the infrared sensors.

Source: PVGPATDIS, file of 2026-04-10 (ipg171219.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
FLIR Systems, Inc. 370 patentsUS company or organizationWilsonville, ORFLIR SYSTEMS INC Form D issuer EXACT high confidence: identical full name and state
FLIR SYSTEMS INC SEC filer EXACT medium confidence: identical full name, one of each nationally
PVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Brian B. SimolonLompoc, CA22PVGPATDIS, file of 2026-04-10
Eric A. KurthLompoc, CA59PVGPATDIS, file of 2026-04-10
Steve BarskeyWilsonville, OR1PVGPATDIS, file of 2026-04-10
Mark NussmeierGoleta, CA30PVGPATDIS, file of 2026-04-10
Nicholas HögastenLompoc, CA92PVGPATDIS, file of 2026-04-10
Theodore R. HoelterGoleta, CA74PVGPATDIS, file of 2026-04-10
Katrin StrandemarRimbo, SE77PVGPATDIS, file of 2026-04-10
Pierre BoulangerGoleta, CA60PVGPATDIS, file of 2026-04-10
Barbara SharpLompoc, CA45PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
H04NPictorial communication, e.g. televisionH04N25/20PVGPATDIS, file of 2026-04-10
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiationH10F39/018PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2021-11-24Merger
Merger and change of name
FIREWORK MERGER SUB II, LLC signed 2021-05-14
FLIR SYSTEMS, INC. signed 2021-05-14
TELEDYNE FLIR, LLC THOUSAND OAKS, CA58832/915ECORSEXC, file of 2026-09-25
2014-01-30Assignment
Assignment of assignor's interest
HOELTER, THEODORE R. signed 2013-12-13
HOGASTEN, NICHOLAS signed 2013-12-13
STRANDEMAR, KATRIN signed 2013-12-16
SHARP, BARBARA signed 2013-12-17
SIMOLON, BRIAN signed 2013-12-17
KURTH, ERIC A. signed 2013-12-20
BARSKEY, STEVE signed 2014-01-13
BOULANGER, PIERRE signed 2014-01-16
NUSSMEIER, MARK signed 2014-01-24
FLIR SYSTEMS, INC. WILSONVILLE, OR32099/307ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.