Patents

US 9821435 B2: Thick cubic boron nitride (CBN) layer and manufacturing process therefor

Granted
2017-11-21
Filed
2012-05-29 application 14119789
Type
Utility · 32 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A method for forming a stand-alone wafer or a coating on a substrate uses a composite of cubic boron nitride (cBN) particles and other materials, such as nitrides, carbides, carbonitrides, borides, oxides, and metallic phase materials. The wafer or coating may be formed of a thickness up to about 1000 microns for improved wear life. The density of material within the wafer or coating may be varied according to desired parameters, and a gradient of particle sizes for the cBN may be presented across the thickness of the material.

Source: PVGPATDIS, file of 2026-04-10 (ipg171121.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
NanoMech, Inc. 11 patentsUS company or organizationSpringdale, ARNANOMECH INC State business registration EXACT high confidence: identical full name and state
NanoMech, Inc. Form D issuer EXACT high confidence: identical full name and state
PVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Wenping JiangFayetteville, AR12PVGPATDIS, file of 2026-04-10
Ajay P. MalsheSpringdale, AR24PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
B24DTools for grinding, buffing or sharpeningB24D3/06PVGPATDIS, file of 2026-04-10
B23BTurning; boringB23B27/141PVGPATDIS, file of 2026-04-10
C04BLime, magnesia; slag; cements; compositions thereof, e.g. mortars, concrete or like building materials; artificial stone ; ceramics ; refractories; treatment of natural stoneC04B35/5831PVGPATDIS, file of 2026-04-10
C23CCoating metallic material; coating material with metallic material; surface treatment of metallic material by diffusion into the surface, by chemical conversion or substitution; coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in generalC23C28/044PVGPATDIS, file of 2026-04-10
Y10TTechnical subjects covered by former us classificationY10T407/24PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2019-08-29Assignment
Assignment of assignor's interest
NANOMECH, INC. signed 2019-07-31P&S GLOBAL HOLDINGS LLC HOUSTON, TX50214/655PASDL, file of 2026-10-15
2018-04-10Security interest Security interest
Security interest
NANOMECH, INC. signed 2018-04-10MICHAELSON CAPITAL SPECIAL FINANCE FUND II, L.P. NEW YORK, NY45494/391PASDL, file of 2026-08-13
2014-01-17Assignment
Assignment of assignor's interest
JIANG, WENPING signed 2014-01-13NANOMECH, INC. FAYETTEVILLE, AR31991/885ECORSEXC, file of 2026-09-25
2014-01-17Assignment
Assignment of assignor's interest
MALSHE, AJAY P. signed 2014-01-13NANOMECH, INC. FAYETTEVILLE, AR31991/825ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.