Patents
US 9799752 B1: Method for forming a thin-film transistor
- Granted
- 2017-10-24
- Filed
- 2016-10-31 application 15338576
- Type
- Utility · 20 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A method of forming a thin-film transistor includes providing a substrate having a top surface and a recess in the top surface. An electrically conductive gate is provided within the recess. A conformal insulating material layer and a conformal semiconductor material layer are formed in the recess, with the semiconductor material layer extending over the top surface of the substrate outside of the recess. Source and drain electrodes are formed by adding a deposition inhibitor material on a portion of the substrate including within the recess; and depositing a thin-film of electrically conductive material, wherein the deposition inhibitor material inhibits the deposition of the electrically conductive material such that the electrically conductive material is patterned by the deposition inhibitor material during deposition, wherein the patterned electrically conductive material provides the source electrode on a first side of the recess and the drain electrode on a second side of the recess.
Source: PVGPATDIS, file of 2026-04-10 (ipg171024.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| EASTMAN KODAK COMPANY 2,417 patents | US company or organization | Rochester, NY | EASTMAN KODAK COMPANY Federal lobbying client EXACT high confidence: identical full name and state EASTMAN KODAK CO SEC filer FUZZY low confidence: same name (legal endings aside), one of each nationally | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Shelby F. Nelson | Pittsford, NY | 63 | PVGPATDIS, file of 2026-04-10 | |
| Carolyn Rae Ellinger | Rochester, NY | 74 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H10D | Inorganic electric semiconductor devices | H10D30/031 | PVGPATDIS, file of 2026-04-10 |
| H01L | Semiconductor devices not covered by class h10 | H01L21/76831 | PVGPATDIS, file of 2026-04-10 |
| H10P | Generic processes or apparatus for the manufacture or treatment of devices covered by class h10 | H10P14/43 | PVGPATDIS, file of 2026-04-10 |
| H10W | Generic packages, interconnections, connectors or other constructional details of devices covered by class h10 | H10W20/031 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2021-03-04 | Security interest Security interest Notice of security interests | EASTMAN KODAK COMPANY signed 2021-02-26 | BANK OF AMERICA, N.A., AS AGENT BOSTON, MA | 56984/1 | PASDL, file of 2026-10-15 |
| 2021-03-04 | Security interest Security interest Intellectual property security agreement | EASTMAN KODAK COMPANY signed 2021-02-26 | ALTER DOMUS (US) LLC CHICAGO, IL | 56734/233 | PASDL, file of 2026-10-15 |
| 2021-03-04 | Security interest Security interest Intellectual property security agreement | EASTMAN KODAK COMPANY signed 2021-02-26 | ALTER DOMUS (US) LLC CHICAGO, IL | 56734/1 | PASDL, file of 2026-10-15 |
| 2021-03-04 | Security interest Security interest Intellectual property security agreement | EASTMAN KODAK COMPANY signed 2021-02-26 | ALTER DOMUS (US) LLC CHICAGO, IL | 56733/681 | PASDL, file of 2026-10-15 |
| 2019-07-30 | Release of security interest Release of security interest | JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT signed 2019-06-17 | EASTMAN KODAK COMPANY ROCHESTER, NY FAR EAST DEVELOPMENT LTD. ROCHESTER, NY PFC, INC. ROCHESTER, NY KODAK (NEAR EAST), INC. ROCHESTER, NY KODAK AMERICAS, LTD. ROCHESTER, NY KODAK IMAGING NETWORK, INC. ROCHESTER, NY KODAK PORTUGUESA LIMITED ROCHESTER, NY KODAK REALTY, INC. ROCHESTER, NY LASER PACIFIC MEDIA CORPORATION ROCHESTER, NY PAKON, INC. ROCHESTER, NY QUALEX, INC. ROCHESTER, NY KODAK PHILIPPINES, LTD. ROCHESTER, NY NPEC, INC. ROCHESTER, NY CREO MANUFACTURING AMERICA LLC ROCHESTER, NY KODAK AVIATION LEASING LLC ROCHESTER, NY | 49901/1 | PASDL, file of 2026-10-15 |
| 2019-07-22 | Release of security interest Release of security interest | JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT signed 2019-06-17 | EASTMAN KODAK COMPANY ROCHESTER, NY FAR EAST DEVELOPMENT LTD. ROCHESTER, NY FPC, INC. ROCHESTER, NY KODAK (NEAR EAST), INC. ROCHESTER, NY KODAK AMERICAS, LTD. ROCHESTER, NY KODAK IMAGING NETWORK, INC. ROCHESTER, NY KODAK PORTUGUESA LIMITED ROCHESTER, NY KODAK REALTY, INC. ROCHESTER, NY LASER PACIFIC MEDIA CORPORATION ROCHESTER, NY PAKON, INC. ROCHESTER, NY QUALEX, INC. ROCHESTER, NY KODAK PHILIPPINES, LTD. ROCHESTER, NY NPEC, INC. ROCHESTER, NY CREO MANUFACTURING AMERICA LLC ROCHESTER, NY KODAK AVIATION LEASING LLC ROCHESTER, NY | 50239/1 | PASDL, file of 2026-10-15 |
| 2016-11-16 | Security interest Security interest Security interest | EASTMAN KODAK COMPANY signed 2016-11-09 FAR EAST DEVELOPMENT LTD. signed 2016-11-09 FPC INC. signed 2016-11-09 KODAK (NEAR EAST), INC. signed 2016-11-09 KODAK AMERICAS, LTD. signed 2016-11-09 KODAK REALTY, INC. signed 2016-11-09 LASER-PACIFIC MEDIA CORPORATION signed 2016-11-09 QUALEX INC. signed 2016-11-09 KODAK PHILIPPINES, LTD. signed 2016-11-09 NPEC INC. signed 2016-11-09 | BANK OF AMERICA N.A. BOSTON, MA | 40340/193 | PASDL, file of 2026-10-15 |
| 2016-11-16 | Security interest Security interest Security interest | EASTMAN KODAK COMPANY signed 2016-11-09 FAR EAST DEVELOPMENT LTD. signed 2016-11-09 FPC INC. signed 2016-11-09 KODAK (NEAR EAST), INC. signed 2016-11-09 KODAK AMERICAS, LTD. signed 2016-11-09 KODAK REALTY, INC. signed 2016-11-09 LASER-PACIFIC MEDIA CORPORATION signed 2016-11-09 QUALEX INC. signed 2016-11-09 KODAK PHILIPPINES, LTD. signed 2016-11-09 NPEC INC. signed 2016-11-09 | JP MORGAN CHASE BANK, N.A. NEWARK, DE | 40340/17 | PASDL, file of 2026-10-15 |
| 2016-10-31 | Assignment Assignment of assignor's interest | ELLINGER, CAROLYN RAE signed 2016-10-25 NELSON, SHELBY FORRESTER signed 2016-10-31 | EASTMAN KODAK COMPANY ROCHESTER, NY | 40172/272 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.