Patents
US 9702736 B2: Housing and method of making same
- Granted
- 2017-07-11
- Filed
- 2012-04-04 application 13439249
- Type
- Utility · 22 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A housing for encapsulating a power supply for a sonde is disclosed. The housing includes an inner support over-molded with an outer sleeve. The inner support may be metal or plastic and may include an outer tube and an inner tube that are integral with one another with the outer tube providing the exterior surface of the inner support and being spaced apart from the inner tube except where the inner and outer tubes share a common arc. When both the inner support and the outer sleeve are plastic, the inner support includes a reinforced plastic and the outer sleeve includes a non-reinforced plastic.
Source: PVGPATDIS, file of 2026-04-10 (ipg170711.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| YSI, INC. 24 patents | US company or organization | Yellow Springs, OH | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Ronald Alan Metzger | Waynesville, OH | 3 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| G01D | Measuring not specially adapted for a specific variable; arrangements for measuring two or more variables not covered in a single other subclass; tariff metering apparatus; measuring or testing not otherwise provided for | G01D5/245 | PVGPATDIS, file of 2026-04-10 |
| F16L | Pipes; joints or fittings for pipes; supports for pipes, cables or protective tubing; means for thermal insulation in general | F16L7/00 | PVGPATDIS, file of 2026-04-10 |
| Y02E | Reduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution | Y02E60/10 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2012-04-13 | Assignment Assignment of assignor's interest | METZGER, RONALD ALAN signed 2012-04-02 | YSI INCORPORATED YELLOW SPRINGS, OH | 28042/715 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.