Patents

US 9658280 B2: Test board and method for qualifying a printed circuit board assembly and/or repair process

Granted
2017-05-23
Filed
2015-02-11 application 14619506
Type
Utility · 6 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A method for qualifying circuit board fabrication, assembly, and repair processes includes establishing primary assembly process specifications and secondary repair process specifications. A group of test circuit boards is assembled using the primary assembly process, with each board having a section of components linked together to provide functional circuits and a section of components daisy-chained together to provide non-functional circuits, and with each section also including SIR test patterns and CAF test patterns. A subset of the assembled test boards is then repaired using the secondary repair process. A sample of each set of the test boards is exposed to test conditions including thermal cycle test conditions, humidity test conditions, and vibration test conditions. Inner layer build quality, surface cleanliness, circuit performance, and solder joint quality are then evaluated using the provided circuitry.

Source: PVGPATDIS, file of 2026-04-10 (ipg170523.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Foresite, Inc. 4 patentsUS company or organizationKokomo, INPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Terry L. MunsonKokomo, IN4PVGPATDIS, file of 2026-04-10
Steve MiddletonNoblesville, IN3PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
G01RMeasuring electric variables; measuring magnetic variablesG01R31/2812PVGPATDIS, file of 2026-04-10
H05KPrinted circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical componentsH05K3/225PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2016-04-13Assignment
Assignment of assignor's interest
MIDDLETON, STEVE signed 2016-04-05
MUNSON, TERRY L. signed 2016-04-13
FORESITE, INC. KOKOMO, IN38264/488ECORSEXC, file of 2026-09-25
2015-12-07Government interest
Confirmatory license
FORESITE, INC. signed 2015-12-02MISSILE DEFENSE AGENCY FORT BELVOIR, VA37229/573ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.