Patents

US 9656350 B2: Removal of selected portions of protective coatings from substrates

Granted
2017-05-23
Filed
2015-09-22 application 14861929
Type
Utility · 25 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed.

Source: PVGPATDIS, file of 2026-04-10 (ipg170523.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
HZO, Inc. 41 patentsUS company or organizationDraper, UTHZO, INC. Form D issuer EXACT high confidence: identical full name and statePVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
David James AstlePark City, UT4PVGPATDIS, file of 2026-04-10
Tyler Christensen ChildSouth Jordan, UT6PVGPATDIS, file of 2026-04-10
Vimal Kumar KasaganiTaylorsville, UT5PVGPATDIS, file of 2026-04-10
Cameron LaMar LooseRoy, UT5PVGPATDIS, file of 2026-04-10
Blake StevensMorristown, NJ22PVGPATDIS, file of 2026-04-10
Max SorensonCottonwood Heights, UT24PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
B23KSoldering or unsoldering; welding; cladding or plating by soldering or welding; cutting by applying heat locally, e.g. flame cutting; working by laser beamB23K26/362PVGPATDIS, file of 2026-04-10
B24CAbrasive or related blasting with particulate materialB24C1/003PVGPATDIS, file of 2026-04-10
C23CCoating metallic material; coating material with metallic material; surface treatment of metallic material by diffusion into the surface, by chemical conversion or substitution; coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in generalC23C14/042PVGPATDIS, file of 2026-04-10
H01LSemiconductor devices not covered by class h10H01L21/561PVGPATDIS, file of 2026-04-10
H05KPrinted circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical componentsH05K3/288PVGPATDIS, file of 2026-04-10
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10H10W74/014PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2023-06-05Security interest Security interest
Security interest
HZO, INC. signed 2023-06-05
HZO HONG KONG LIMITED signed 2023-06-05
CATHAY BANK EL MONTE, CA63861/25PASDL, file of 2026-10-05
2019-02-07Security interest Security interest
Security interest
HZO, INC. signed 2019-02-04CATHAY BANK EL MONTE, CA48284/626ECORSEXC, file of 2026-09-25
2018-01-03Security interest Security interest
Security interest
HZO, INC. signed 2017-12-27CATHAY BANK EL MONTE, CA44995/270ECORSEXC, file of 2026-09-25
2018-01-03Release of security interest
Release of security interest
PACIFIC WESTERN BANK signed 2017-12-29HZO, INC. DRAPER, UT44523/446ECORSEXC, file of 2026-09-25
2016-05-02Security interest Security interest
Security interest
HZO, INC. signed 2013-09-23PACIFIC WESTERN BANK (AS SUCCESSOR IN INTEREST BY MERGER TO SQUARE 1 BANK) DURHAM, NC38435/224ECORSEXC, file of 2026-09-25
2015-09-23Assignment
Assignment of assignor's interest
CHILD, TYLER CHRISTENSEN signed 2014-01-13
KASAGANI, VIMAL KUMAR signed 2014-01-13
LOOSE, CAMERON LAMAR signed 2014-01-13
SORENSON, MAX signed 2014-01-13
STEVENS, BLAKE signed 2014-04-01
ASTLE, DAVID JAMES signed 2014-04-15
HZO, INC. DRAPER, UT36638/858ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.