Patents
US 9627194 B2: Methods for masking and applying protective coatings to electronic assemblies
- Granted
- 2017-04-18
- Filed
- 2014-11-14 application 14542318
- Type
- Utility · 13 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
One or more masks may be used to control the application of protective (e.g., moisture-resistant, etc.) coatings to one or more portions of various components of an electronic device during assembly of the electronic device. A method for applying a protective coating to an electronic device includes assembling two or more components of the electronic device with one another. A mask may then be applied to the resulting electronic assembly. The mask may shield selected portions of the electronic assembly, while other portions of the electronic assembly, i.e., those to which a protective coating is to be applied, may remain exposed through the mask. With the mask in place, application of a protective coating to portions of the electronic assembly exposed through the mask may commence. After application of the protective coating, the mask may be removed from the electronic assembly. Embodiments of masked electronic assemblies are also disclosed.
Source: PVGPATDIS, file of 2026-04-10 (ipg170418.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| HZO, Inc. 41 patents | US company or organization | Draper, UT | HZO, INC. Form D issuer EXACT high confidence: identical full name and state | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Blake Stevens | Morristown, NJ | 22 | PVGPATDIS, file of 2026-04-10 | |
| Max Sorenson | Cottonwood Heights, UT | 24 | PVGPATDIS, file of 2026-04-10 | |
| Sidney Edward Martin, III | Murray, KY | 1 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H10P | Generic processes or apparatus for the manufacture or treatment of devices covered by class h10 | H10P14/6502 | PVGPATDIS, file of 2026-04-10 |
| B05C | Apparatus for applying fluent materials to surfaces, in general | B05C21/005 | PVGPATDIS, file of 2026-04-10 |
| H05K | Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components | H05K1/02 | PVGPATDIS, file of 2026-04-10 |
| H10W | Generic packages, interconnections, connectors or other constructional details of devices covered by class h10 | H10W42/00 | PVGPATDIS, file of 2026-04-10 |
| H01L | Semiconductor devices not covered by class h10 | H01L2924/0002 | PVGPATDIS, file of 2026-04-10 |
| Y10T | Technical subjects covered by former us classification | Y10T29/49002 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2023-06-05 | Security interest Security interest Security interest | HZO, INC. signed 2023-06-05 HZO HONG KONG LIMITED signed 2023-06-05 | CATHAY BANK EL MONTE, CA | 63861/25 | PASDL, file of 2026-10-05 |
| 2019-02-07 | Security interest Security interest Security interest | HZO, INC. signed 2019-02-04 | CATHAY BANK EL MONTE, CA | 48284/626 | ECORSEXC, file of 2026-09-25 |
| 2018-01-03 | Security interest Security interest Security interest | HZO, INC. signed 2017-12-27 | CATHAY BANK EL MONTE, CA | 44995/270 | ECORSEXC, file of 2026-09-25 |
| 2018-01-03 | Release of security interest Release of security interest | PACIFIC WESTERN BANK signed 2017-12-29 | HZO, INC. DRAPER, UT | 44523/446 | ECORSEXC, file of 2026-09-25 |
| 2016-05-02 | Security interest Security interest Security interest | HZO, INC. signed 2013-09-23 | PACIFIC WESTERN BANK (AS SUCCESSOR IN INTEREST BY MERGER TO SQUARE 1 BANK) DURHAM, NC | 38435/224 | ECORSEXC, file of 2026-09-25 |
| 2014-11-14 | Assignment Assignment of assignor's interest | SORENSON, MAX signed 2013-02-20 MARTIN, SIDNEY EDWARD, III signed 2013-02-21 STEVENS, BLAKE signed 2013-02-21 | HZO, INC. DRAPER, UT | 34178/846 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.