Patents

US 9473681 B2: Infrared camera system housing with metalized surface

Granted
2016-10-18
Filed
2013-08-13 application 13966052
Type
Utility · 24 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A housing for an infrared camera module may be implemented with a substantially non-metal cover configured to substantially or completely enclose various components of an infrared imaging device. A metal layer may be disposed on various interior and/or exterior surfaces of the cover. Such implementations may be used to reduce the effects of various environmental conditions which may otherwise adversely affect the performance of the infrared imaging device. In addition, one or more conductive traces may be built into the housing and/or on interior surfaces of the housing to facilitate the passing of signals from components of the infrared imaging device such as infrared sensors, read out circuitry, a temperature measurement component, and/or other components. One or more fiducial markers may be provided to align various components of the infrared camera module during manufacture.

Source: PVGPATDIS, file of 2026-04-10 (ipg161018.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
FLIR Systems, Inc. 370 patentsUS company or organizationWilsonville, ORFLIR SYSTEMS INC Form D issuer EXACT high confidence: identical full name and state
FLIR SYSTEMS INC SEC filer EXACT medium confidence: identical full name, one of each nationally
PVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Theodore R. HoelterGoleta, CA74PVGPATDIS, file of 2026-04-10
Joseph KostrzewaBuellton, CA22PVGPATDIS, file of 2026-04-10
Pierre BoulangerGoleta, CA60PVGPATDIS, file of 2026-04-10
Barbara SharpLompoc, CA45PVGPATDIS, file of 2026-04-10
Eric A. KurthLompoc, CA59PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
H04NPictorial communication, e.g. televisionH04N23/51PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2021-11-24Merger
Merger and change of name
FIREWORK MERGER SUB II, LLC signed 2021-05-14
FLIR SYSTEMS, INC. signed 2021-05-14
TELEDYNE FLIR, LLC THOUSAND OAKS, CA58832/915ECORSEXC, file of 2026-09-25
2013-11-08Assignment
Assignment of assignor's interest
KOSTRZEWA, JOSEPH signed 2013-08-19
HOELTER, THEODORE R. signed 2013-10-22
BOULANGER, PIERRE signed 2013-10-23
KURTH, ERIC A. signed 2013-10-25
SHARP, BARBARA signed 2013-11-01
FLIR SYSTEMS, INC. WILSONVILLE, OR31571/924ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.