Patents

US 9446190 B2: Hypodermic needle assembly and related methods

Granted
2016-09-20
Filed
2013-03-08 application 13791885
Type
Utility · 19 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A needle assembly for a hypodermic syringe is disclosed herein. In various aspects, the needle assembly includes a hub and a needle. A bond secures the needle to the hub, and the bond is configured to break allowing the needle to be withdrawn entirely from the hub upon application of a selected axial force to the needle, in various aspects. The axial force may be less than the tensile strength of the needle. Related methods of use of the needle assembly apparatus are disclosed herein.This Abstract is presented to meet requirements of 37 C.F.R. ยง1.72(b) only. This Abstract is not intended to identify key elements of the apparatus and the related methods disclosed herein or to delineate the scope thereof.

Source: PVGPATDIS, file of 2026-04-10 (ipg160920.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
MEDTECH SYSTEMS INC 1 patentsUS company or organizationMayer, MNPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Gary MillerGlencoe, MN17PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
A61MDevices for introducing media into, or onto, the body ; devices for transducing body media or for taking media from the body ; devices for producing or ending sleep or stuporA61M5/32PVGPATDIS, file of 2026-04-10
G16ZInformation and communication technology [ict] specially adapted for specific application fields, not otherwise provided forG16Z99/00PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2015-12-08Assignment
Confirmation of patent assignment
MILLER, GARY E. signed 2015-12-08MEDTECH SYSTEMS, INC. MAYER, MN37245/872PASDL, file of 2026-10-15
2015-12-04Assignment
Assignment of assignor's interest
MILLER, GARY E signed 2012-06-26MEDTECH SYSTEMS INC. MAYER, MN37213/13PASDL, file of 2026-10-15

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.