Patents

US 9395411 B2: Method for testing a test substrate under defined thermal conditions and thermally conditionable prober

Granted
2016-07-19
Filed
2013-07-29 application 13953545
Type
Utility · 9 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

In a method and a device for testing a test substrate under defined thermal conditions, a substrate that is to be tested is held by a temperature-controllable chuck and is set to a defined temperature; the test substrate is positioned relative to test probes by at least one positioning device; and the test probes make contact with the test substrate for testing purposes. At least one component of the positioning device that is present in the vicinity of the temperature-controlled test substrate is set to a temperature that is independent of the temperature of the test substrate by a temperature-controlling device, and this temperature is held constant.

Source: PVGPATDIS, file of 2026-04-10 (ipg160719.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Cascade Microtech, Inc. 96 patentsUS company or organizationBeaverton, ORCASCADE MICROTECH INC SEC filer EXACT medium confidence: identical full name, one of each nationallyPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Joerg KiesewetterOrtrand, DE4PVGPATDIS, file of 2026-04-10
Stojan KanevOrtrand, DE36PVGPATDIS, file of 2026-04-10
Michael TeichBad Marienberg, DE16PVGPATDIS, file of 2026-04-10
Karsten StollWilthen, DE9PVGPATDIS, file of 2026-04-10
Axel SchmidtOrtrand, DE31PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
G01RMeasuring electric variables; measuring magnetic variablesG01R31/2891PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2025-08-07Release of security interest
Release of security interest
HSBC BANK USA, NATIONAL ASSOCIATION signed 2025-08-06FORMFACTOR, INC. LIVERMORE, CA72853/1PASDL, file of 2026-10-15
2021-09-01Assignment
Assignment of assignor's interest
FORMFACTOR BEAVERTON, INC. signed 2021-08-26FORMFACTOR, INC. LIVERMORE, CA57393/609PASDL, file of 2026-10-15
2018-07-18Name change
Change of name
CASCADE MICROTECH, INC. signed 2018-05-14FORMFACTOR BEAVERTON, INC. BEAVERTON, OR46573/664PASDL, file of 2026-10-15
2016-07-12Security interest Security interest
Security interest in united states patents and trademarks
FORMFACTOR, INC. signed 2016-06-24
ASTRIA SEMICONDUCTOR HOLDINGS, INC. signed 2016-06-24
CASCADE MICROTECH, INC. signed 2016-06-24
MICRO-PROBE INCORPORATED signed 2016-06-24
HSBC BANK USA, NATIONAL ASSOCIATION SAN FRANCISCO, CA39184/280PASDL, file of 2026-10-15
2014-11-06Merger
Merger
SUSS MICROTEC TEST SYSTEMS GMBH signed 2010-01-27CASCADE MICROTECH, INC. BEAVERTON, OR34179/359ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.