Patents
US 9372214 B2: High frequency interconnect structures, electronic assemblies that utilize high frequency interconnect structures, and methods of operating the same
- Granted
- 2016-06-21
- Filed
- 2012-05-31 application 13484548
- Type
- Utility · 35 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
High frequency interconnect structures, electronic assemblies that utilize high frequency interconnect structures, and methods of operating the same. The high frequency interconnect structures include a plurality of dielectric waveguides and are configured to communicatively connect a plurality of transmitters with a plurality of receivers and to convey a plurality of signals therebetween. The plurality of signals may include a plurality of electromagnetic waves and may have a frequency of at least 200 GHz. The high frequency interconnect structures further may be configured to decrease a potential for crosstalk between a first signal that is conveyed by a first dielectric waveguide of the plurality of dielectric waveguides and a second signal that is conveyed by a second dielectric waveguide of the plurality of dielectric waveguides, such as through control of a passband of the first dielectric waveguide relative to the second dielectric waveguide and/or the use of a crosstalk mitigation structure.
Source: PVGPATDIS, file of 2026-04-10 (ipg160621.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Cascade Microtech, Inc. 96 patents | US company or organization | Beaverton, OR | CASCADE MICROTECH INC SEC filer EXACT medium confidence: identical full name, one of each nationally | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Eric W. Strid | Portland, OR | 16 | PVGPATDIS, file of 2026-04-10 | |
| Richard Campbell | Portland, OR | 8 | PVGPATDIS, file of 2026-04-10 | |
| Kenneth R. Smith | Beaverton, OR | 20 | PVGPATDIS, file of 2026-04-10 | |
| K. Reed Gleason | Portland, OR | 18 | PVGPATDIS, file of 2026-04-10 | |
| Kooho Jung | Beaverton, OR | 2 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| G01R | Measuring electric variables; measuring magnetic variables | G01R23/02 | PVGPATDIS, file of 2026-04-10 |
| H01P | Waveguides; resonators, lines, or other devices of the waveguide type | H01P3/16 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2025-08-07 | Release of security interest Release of security interest | HSBC BANK USA, NATIONAL ASSOCIATION signed 2025-08-06 | FORMFACTOR, INC. LIVERMORE, CA | 72853/1 | PASDL, file of 2026-10-15 |
| 2021-09-01 | Assignment Assignment of assignor's interest | FORMFACTOR BEAVERTON, INC. signed 2021-08-26 | FORMFACTOR, INC. LIVERMORE, CA | 57393/609 | PASDL, file of 2026-10-15 |
| 2018-07-18 | Name change Change of name | CASCADE MICROTECH, INC. signed 2018-05-14 | FORMFACTOR BEAVERTON, INC. BEAVERTON, OR | 46573/664 | PASDL, file of 2026-10-15 |
| 2016-07-12 | Security interest Security interest Security interest in united states patents and trademarks | FORMFACTOR, INC. signed 2016-06-24 ASTRIA SEMICONDUCTOR HOLDINGS, INC. signed 2016-06-24 CASCADE MICROTECH, INC. signed 2016-06-24 MICRO-PROBE INCORPORATED signed 2016-06-24 | HSBC BANK USA, NATIONAL ASSOCIATION SAN FRANCISCO, CA | 39184/280 | PASDL, file of 2026-10-15 |
| 2012-05-31 | Assignment Assignment of assignor's interest | CAMPBELL, RICHARD L. signed 2012-05-24 GLEASON, K. REED signed 2012-05-29 JUNG, KOOHO signed 2012-05-29 SMITH, KENNETH R. signed 2012-05-29 STRID, ERIC W. signed 2012-05-30 | CASCADE MICROTECH, INC. BEAVERTON, OR | 28294/799 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.