Patents

US 9244099 B2: Probe head assemblies, components thereof, test systems including the same, and methods of operating the same

Granted
2016-01-26
Filed
2012-05-03 application 13463712
Type
Utility · 28 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Probe head assemblies, components of probe head assemblies, test systems including the probe head assemblies and/or components thereof, and methods of operating the same. The probe head assemblies are configured to convey a plurality of test signals to and/or from a device under test and include a space transformer, a contacting assembly, and a riser that spatially separates the space transformer from the contacting assembly and conveys the plurality of test signals between the space transformer and the contacting assembly. The contacting assembly may include a frame that defines an aperture and has a coefficient of thermal expansion that is within a threshold difference of that of the device under test, a flexible dielectric body that is attached to the frame, maintained in tension by the frame, and extends across the aperture, and a plurality of conductive probes. The plurality of conductive probes may include a dual-faceted probe tip.

Source: PVGPATDIS, file of 2026-04-10 (ipg160126.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Cascade Microtech, Inc. 96 patentsUS company or organizationBeaverton, ORCASCADE MICROTECH INC SEC filer EXACT medium confidence: identical full name, one of each nationallyPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Koby L. DuckworthNewberg, OR8PVGPATDIS, file of 2026-04-10
Eric Lyell HillPortland, OR13PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
G01RMeasuring electric variables; measuring magnetic variablesG01R1/0735PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2025-08-07Release of security interest
Release of security interest
HSBC BANK USA, NATIONAL ASSOCIATION signed 2025-08-06FORMFACTOR, INC. LIVERMORE, CA72853/1PASDL, file of 2026-10-15
2021-09-01Assignment
Assignment of assignor's interest
FORMFACTOR BEAVERTON, INC. signed 2021-08-26FORMFACTOR, INC. LIVERMORE, CA57393/609PASDL, file of 2026-10-15
2018-07-18Name change
Change of name
CASCADE MICROTECH, INC. signed 2018-05-14FORMFACTOR BEAVERTON, INC. BEAVERTON, OR46573/664PASDL, file of 2026-10-15
2016-07-12Security interest Security interest
Security interest in united states patents and trademarks
FORMFACTOR, INC. signed 2016-06-24
ASTRIA SEMICONDUCTOR HOLDINGS, INC. signed 2016-06-24
CASCADE MICROTECH, INC. signed 2016-06-24
MICRO-PROBE INCORPORATED signed 2016-06-24
HSBC BANK USA, NATIONAL ASSOCIATION SAN FRANCISCO, CA39184/280PASDL, file of 2026-10-15
2012-05-03Assignment
Assignment of assignor's interest
DUCKWORTH, KOBY signed 2012-05-02
HILL, ERIC signed 2012-05-02
CASCADE MICROTECH, INC. BEAVERTON, OR28153/229ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.