Patents
US 9198283 B2: Vertically spaced electrode structure
- Granted
- 2015-11-24
- Filed
- 2014-03-06 application 14198658
- Type
- Utility · 12 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A vertically separated electrode structure includes a polymeric material post on a substrate. An inorganic material cap covers the top of the post and extends beyond an edge of the post in at least a width dimension to define a first reentrant profile. A first electrode is located over the cap. A second electrode is located over the substrate and not over the post. The second electrode is adjacent to the edge of the post in the reentrant profile such that a distance between the first electrode and second electrode is greater than zero when measured orthogonally to the substrate surface. The first electrode and second electrode have the same material composition and layer thickness.
Source: PVGPATDIS, file of 2026-04-10 (ipg151124.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| EASTMAN KODAK COMPANY 2,417 patents | US company or organization | Rochester, NY | EASTMAN KODAK COMPANY Federal lobbying client EXACT high confidence: identical full name and state EASTMAN KODAK CO SEC filer FUZZY low confidence: same name (legal endings aside), one of each nationally | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Carolyn Rae Ellinger | Rochester, NY | 74 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H05K | Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components | H05K1/0284 | PVGPATDIS, file of 2026-04-10 |
| C23C | Coating metallic material; coating material with metallic material; surface treatment of metallic material by diffusion into the surface, by chemical conversion or substitution; coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general | C23C16/345 | PVGPATDIS, file of 2026-04-10 |
| H10D | Inorganic electric semiconductor devices | H10D30/6728 | PVGPATDIS, file of 2026-04-10 |
| H10W | Generic packages, interconnections, connectors or other constructional details of devices covered by class h10 | H10W72/00 | PVGPATDIS, file of 2026-04-10 |
| H01L | Semiconductor devices not covered by class h10 | H01L2924/0002 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2021-03-04 | Security interest Security interest Notice of security interests | EASTMAN KODAK COMPANY signed 2021-02-26 | BANK OF AMERICA, N.A., AS AGENT BOSTON, MA | 56984/1 | PASDL, file of 2026-10-15 |
| 2021-03-04 | Security interest Security interest Intellectual property security agreement | EASTMAN KODAK COMPANY signed 2021-02-26 | ALTER DOMUS (US) LLC CHICAGO, IL | 56734/233 | PASDL, file of 2026-10-15 |
| 2021-03-04 | Security interest Security interest Intellectual property security agreement | EASTMAN KODAK COMPANY signed 2021-02-26 | ALTER DOMUS (US) LLC CHICAGO, IL | 56734/1 | PASDL, file of 2026-10-15 |
| 2021-03-04 | Security interest Security interest Intellectual property security agreement | EASTMAN KODAK COMPANY signed 2021-02-26 | ALTER DOMUS (US) LLC CHICAGO, IL | 56733/681 | PASDL, file of 2026-10-15 |
| 2014-03-06 | Assignment Assignment of assignor's interest | ELLINGER, CAROLYN RAE signed 2014-03-03 | EASTMAN KODAK COMPANY ROCHESTER, NY | 32364/488 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.