Patents
US 9172211 B2: Heating elements for multi-wavelength DBR laser
- Granted
- 2015-10-27
- Filed
- 2011-11-09 application 13292385
- Type
- Utility · 20 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A multi-wavelength distributed Bragg reflector (DBR) semiconductor laser is provided where DBR heating elements are positioned over the waveguide in the DBR section and define an interleaved temperature profile that generates multiple distinct reflection peaks corresponding to distinct temperature dependent Bragg wavelengths associated with the temperature profile. Neighboring pairs of heating elements of the DBR heating elements positioned over the waveguide in the DBR section are spaced along the direction of the axis of optical propagation by a distance that is equal to or greater than the laser chip thickness b to minimize the impact of thermal crosstalk between distinct temperature regions of the interleaved temperature profile.
Source: PVGPATDIS, file of 2026-04-10 (ipg151027.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Thorlabs Quantum Electronics, Inc. 19 patents | US company or organization | Jessup, MD | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Dmitri Vladislavovich Kuksenkov | Big Flats, NY | 32 | PVGPATDIS, file of 2026-04-10 | |
| Shenping Li | Corning, NY | 28 | PVGPATDIS, file of 2026-04-10 | |
| Hong Ky Nguyen | Corning, NY | 4 | PVGPATDIS, file of 2026-04-10 | |
| Chung-En Zah | Holmdel, NJ | 33 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H01S | Devices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light; devices using stimulated emission of electromagnetic radiation in wave ranges other than optical | H01S5/0612 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2014-11-21 | Assignment Assignment of assignor's interest | CORNING INCORPORATED signed 2014-10-24 | THORLABS QUANTUM ELECTRONICS, INC. JESSUP, MD | 34408/556 | PASDL, file of 2026-10-15 |
| 2011-11-09 | Assignment Assignment of assignor's interest | KUKSENKOV, DMITRI VLADISLAVOVICH signed 2011-11-08 LI, SHENPING signed 2011-11-08 NGUYEN, HONG KY signed 2011-11-08 ZAH, CHUNG-EN signed 2011-11-08 | CORNING INCORPORATED CORNING, NY | 27199/573 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.