Patents

US 9107001 B2: Earphones having configurable microphone arrays

Granted
2015-08-11
Filed
2013-09-26 application 14348629
Type
Utility · 31 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Accessories for a telephone include at least one earphone and at least one microphone array having multiple microphones used to generate outgoing audio signals for (i) processing by a signal processor and (ii) transmission by the telephone. In one embodiment, two earphones are connected by two corresponding wires, and two microphone arrays, respectively connected to the two wires, are mechanically and electronically configurable in a plurality of use modes to generate outgoing audio signals for processing by the signal processor. The use modes include one or more and possibly all of a single-sided mode, a two-sided mode, an enhanced directivity mode, a stereo recording mode, a multichannel recording mode, a conference mode, and a two-dimensional-array mode, where one of the use modes is automatically detected by the signal processor based on the audio signals generated by the two microphone arrays.

Source: PVGPATDIS, file of 2026-04-10 (ipg150811.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
MH Acoustics, LLC 19 patentsUS company or organizationSummit, NJPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Eric John DiethornLong Valley, NJ20PVGPATDIS, file of 2026-04-10
Gary W. ElkoSummit, NJ26PVGPATDIS, file of 2026-04-10
Jens M. MeyerSaint Albans, VT17PVGPATDIS, file of 2026-04-10
Tomas F. GaenslerHackettstown, NJ11PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers; electric hearing aids; public address systemsH04R1/1091PVGPATDIS, file of 2026-04-10
H04MTelephonic communicationH04M1/05PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2014-03-31Assignment
Assignment of assignor's interest
DIETHORN, ERIC J. signed 2013-09-27
ELKO, GARY W. signed 2013-09-27
GAENSLER, TOMAS F. signed 2013-09-27
MEYER, JENS M. signed 2013-09-27
MH ACOUSTICS, LLC SUMMIT, NJ32558/28ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.