Patents
US 8994490 B2: Chip resistor with outrigger heat sink
- Granted
- 2015-03-31
- Filed
- 2013-08-30 application 14015914
- Type
- Utility · 20 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A surface mount chip resistor for increasing power handling capabilities of radio frequency (RF) circuits and for minimizing parasitic capacitance and inductance effects, the chip resistor includes a ceramic substrate having a main portion and an outrigger. A resistor element is between an input contact and an output contact on a top surface of the main portion. A ground plane attachment area is on a top surface of the outrigger. The ground plane attachment area is mounted to a ground plane of a circuit board to provide a heat pathway for dissipating heat generated by the resistor element.
Source: PVGPATDIS, file of 2026-04-10 (ipg150331.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Smiths Interconnect Microwave Components, Inc. 4 patents | US company or organization | Stuart, FL | SMITHS INTERCONNECT MICROWAVE COMPONENTS, INC. State business registration EXACT high confidence: identical full name and state | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Paul Davidsson | Stuart, FL | 2 | PVGPATDIS, file of 2026-04-10 | |
| Robert J. Blacka | Port St. Lucie, FL | 1 | PVGPATDIS, file of 2026-04-10 | |
| Kai Siang Loh | Port St. Lucie, FL | 4 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H05K | Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components | H05K7/2039 | PVGPATDIS, file of 2026-04-10 |
| H01C | Resistors | H01C1/01 | PVGPATDIS, file of 2026-04-10 |
| H04B | Transmission | H04B1/00 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2019-03-25 | Name change Change of name | INTERCONNECT DEVICES, INC. signed 2017-07-31 | SMITHS INTERCONNECT AMERICAS, INC. WILMINGTON,, DE | 48682/212 | ECORSEXC, file of 2026-09-25 |
| 2019-03-25 | Merger Merger | SMITHS INTERCONNECT MICROWAVE COMPONENTS, INC. signed 2017-07-31 | INTERCONNECT DEVICES, INC. WILMINGTON,, DE | 48682/201 | ECORSEXC, file of 2026-09-25 |
| 2013-08-30 | Assignment Assignment of assignor's interest | BLACKA, ROBERT signed 2013-08-30 DAVIDSSON, PAUL signed 2013-08-30 LOH, KAI signed 2013-08-30 | SMITHS INTERCONNECT MICROWAVE COMPONENTS, INC. STUART, FL | 31121/815 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.