Patents
US 8903106 B2: Augmented elliptical microphone array
- Granted
- 2014-12-02
- Filed
- 2008-07-09 application 12595082
- Type
- Utility · 13 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
In one embodiment, an audio system has a microphone array and a signal processing subsystem that processes audio signals generated by the microphone array to produce an output beampattern. The microphone array has (i) a plurality microphones arranged in a circular portion and (ii) a center microphone. The signal processing subsystem has (1) a decomposer that spatially decomposes the microphone audio signals to generate a plurality of eigenbeams and (2) a beamformer that generates the output beampattern as a weighted sum of the eigenbeams. By adding the center microphone, the audio system is able to provide some degree of control over the beamforming in the vertical direction as well as provide reduction of modal aliasin.
Source: PVGPATDIS, file of 2026-04-10 (ipg141202.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| MH Acoustics, LLC 19 patents | US company or organization | Summit, NJ | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Jens M. Meyer | Colden, NY | 17 | PVGPATDIS, file of 2026-04-10 | |
| Gary W. Elko | Summit, NJ | 26 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H04R | Loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers; electric hearing aids; public address systems | H04R3/005 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2009-10-08 | Assignment Assignment of assignor's interest | ELKO, GARY W. signed 2009-10-07 MEYER, JENS M. signed 2009-10-07 | MH ACOUSTICS LLC SUMMIT, NJ | 23344/391 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.