Patents

US 8743207 B2: Infrared camera architecture systems and methods

Granted
2014-06-03
Filed
2010-07-27 application 12844124
Type
Utility · 20 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

An infrared camera architecture includes, for an embodiment, an infrared detector, a substrate, a plurality of electrical components coupled to the substrate, and a pedestal made of a thermally conductive material and having a leg coupled to the substrate. The infrared detector is supported by and thermally coupled to the pedestal, with the pedestal thermally isolating the infrared detector from the plurality of electrical components.

Source: PVGPATDIS, file of 2026-04-10 (ipg140603.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
FLIR Systems, Inc. 370 patentsUS company or organizationWilsonville, ORFLIR SYSTEMS INC Form D issuer EXACT high confidence: identical full name and state
FLIR SYSTEMS INC SEC filer EXACT medium confidence: identical full name, one of each nationally
PVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Pierre BoulangerGoleta, CA60PVGPATDIS, file of 2026-04-10
Marcel TremblayGoleta, CA30PVGPATDIS, file of 2026-04-10
Jim GoodlandLompoc, CA4PVGPATDIS, file of 2026-04-10
Barbara SharpLompoc, CA45PVGPATDIS, file of 2026-04-10
Farhad MirbodLompoc, CA3PVGPATDIS, file of 2026-04-10
Theodore R. HoelterGoleta, CA74PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light; colorimetry; radiation pyrometryG01J5/20PVGPATDIS, file of 2026-04-10
H04NPictorial communication, e.g. televisionH04N23/23PVGPATDIS, file of 2026-04-10
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiationH10F39/026PVGPATDIS, file of 2026-04-10
H10NElectric solid-state devices not otherwise provided forH10N15/10PVGPATDIS, file of 2026-04-10
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h10H10P74/207PVGPATDIS, file of 2026-04-10
Y10TTechnical subjects covered by former us classificationY10T29/49826PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2021-11-24Merger
Merger and change of name
FIREWORK MERGER SUB II, LLC signed 2021-05-14
FLIR SYSTEMS, INC. signed 2021-05-14
TELEDYNE FLIR, LLC THOUSAND OAKS, CA58832/915ECORSEXC, file of 2026-09-25
2010-07-27Assignment
Assignment of assignor's interest
BOULANGER, PIERRE signed 2010-07-26
GOODLAND, JIM signed 2010-07-26
HOELTER, THEODORE R. signed 2010-07-26
MIRBOD, FARHAD signed 2010-07-26
SHARP, BARBARA signed 2010-07-26
TREMBLAY, MARCEL signed 2010-07-26
FLIR SYSTEMS, INC. WILSONVILLE, OR24746/417ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.