Patents

US 8728964 B2: Glass composition with low coefficient of thermal expansion, and glass fiber produced from same

Granted
2014-05-20
Filed
2012-01-11 application 13348073
Type
Utility · 17 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

The present disclosure relates to a glass composition having a low thermal expansion coefficient, specifically, a glass composition comprising about 55 to less than 64 weight percent of silicon oxide, about 15 to about 30 weight percent of aluminum oxide, about 5 to about 15 weight percent of magnesium oxide, about 3 to about 10 weight percent boron oxide, about 0 to about 11 weight percent calcium oxide, and about 0 to about 2 weight percent of alkali oxide, the remainder being trace compounds of less than about 1 weight percent, is provided. Glass fibers and composite articles formed therefrom are also provided.

Source: PVGPATDIS, file of 2026-04-10 (ipg140520.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
AGY HOLDING CORPORATION 6 patentsUS company or organizationAiken, SCAGY HOLDING CORPORATION Federal lobbying client EXACT high confidence: identical full name and state
AGY HOLDING CORP. SEC filer FUZZY low confidence: same name (legal endings aside), one of each nationally
AGY HOLDING CORP. State business registration FUZZY medium confidence: same name (legal endings aside) and state
PVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Sudhendra V. HublikarMartinez, GA1PVGPATDIS, file of 2026-04-10
Robert Lurie HausrathAiken, SC5PVGPATDIS, file of 2026-04-10
Anthony V. LongobardoJohnston, SC5PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
C03CChemical composition of glasses, glazes or vitreous enamels; surface treatment of glass; surface treatment of fibres or filaments made from glass, minerals or slags; joining glass to glass or other materialsC03C3/091PVGPATDIS, file of 2026-04-10
H05KPrinted circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical componentsH05K1/0306PVGPATDIS, file of 2026-04-10
Y10TTechnical subjects covered by former us classificationY10T428/24818PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2020-09-21Release of security interest
Release of security interest
WELLS FARGO BANK, NATIONAL ASSOCIATION signed 2020-09-21AGY HOLDING CORP. AIKEN, SC53836/520PASDL, file of 2026-10-15
2020-09-21Release of security interest
Release of security interest
U.S. BANK NATIONAL ASSOCIATION signed 2020-09-21AGY HOLDING CORP. AIKEN, SC53836/470PASDL, file of 2026-10-15
2020-09-21Security interest Security interest
Security interest
AGY HOLDING CORP. signed 2020-09-03TCW ASSET MANAGEMENT COMPANY LLC NEW YORK, NY53836/429PASDL, file of 2026-10-15
2015-07-24Security interest Security interest
Patent security agreement
AGY HOLDING CORP. signed 2015-05-22WELLS FARGO BANK, NATIONAL ASSOCIATION SANTA MONICA, CA36180/47PASDL, file of 2026-10-15
2015-06-26Correction
Corrective assignment to correct the assignees' and assignor's name previously recorded on reel 035904 frame 0070. assignor(s) hereby confirms the release of security interest in patents.
UBS AG signed 2015-05-22AGY HOLDING CORP. AIKEN, SC
AGY AIKEN LLC AIKEN, SC
AGY PA OPERATIONS LLC F/K/A AGY HUNTINGDON LLC AIKEN, SC
36080/313PASDL, file of 2026-10-15
2015-06-12Release of security interest
Release of security interest in patents
AGY HOLDING CORP. signed 2015-05-22
AGY AIKEN LLC signed 2015-05-22
AGY PA OPERATIONS LLC F/K/A AGY HUNTINGDON LLC signed 2015-05-22
UBS AG STAMFORD, CT35904/70PASDL, file of 2026-10-15
2015-06-10Release of security interest
Release of security interest
UBS AG, STAMFORD BRANCH, AS AGENT signed 2015-05-22AGY HOLDING CORP. AIKEN, SC
AGY AIKEN LLC AIKEN, SC
AGY HUNTINGDON LLC AIKEN, SC
35880/51PASDL, file of 2026-10-15
2013-07-01Security interest Security interest
Patent security agreement
AGY HOLDING CORP. signed 2013-06-28U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT BOSTON, MA30744/838PASDL, file of 2026-10-15
2013-07-01Security interest Security interest
Patent security agreement
AGY HOLDING CORP. signed 2013-06-28WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT BOSTON, MA30744/823PASDL, file of 2026-10-15
2013-05-13Security interest Security interest
Security agreement
AGY HOLDING CORP. signed 2012-06-15
AGY AIKEN LLC signed 2012-06-15
AGY HUNTINGDON LLC signed 2012-06-15
UBS AG, STAMFORD BRANCH, AS AGENT STAMFORD, CT30406/847PASDL, file of 2026-10-15
2012-10-03Assignment
Assignment of assignor's interest
HUBLIKAR, SUDHENDRA V. signed 2010-12-21
HAUSRATH, ROBERT L. signed 2010-12-21
LONGOBARDO, ANTHONY V. signed 2010-12-21
AGY HOLDING CORPORATION AIKEN, SC29067/286PASDL, file of 2026-10-15

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.