Patents
US 8537554 B1: Structured relief dielectric heat sink for planar photovoltaic cells and semiconductor devices
- Granted
- 2013-09-17
- Filed
- 2010-05-17 application 12800537
- Type
- Utility · 25 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
Distribution and coupling of waste heat from planar non-concentration photovoltaic cells and semiconductor electrical devices is enhanced by forming dielectric relief structures and thermal conductive and emissive coatings on the cover and/or backing plate. The composite relief structures of layers, voids, and fins on the back surface mitigate the differential thermal expansion of dissimilar material and optimize convective heat transfer and radiant heat transfer with respect to costs. This leads to higher performance of the photovoltaic and semiconductor cells, a stronger and lighter backing plate components, and lower cost per watt for mounted devices.
Source: PVGPATDIS, file of 2026-04-10 (ipg130917.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Energy Related Devices, Inc. 4 patents | US company or organization | Tucumcari, NM | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Robert G. Hockaday | Los Alamos, NM | 13 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H01L | Semiconductor devices not covered by class h10 | H01L23/467 | PVGPATDIS, file of 2026-04-10 |
| H10W | Generic packages, interconnections, connectors or other constructional details of devices covered by class h10 | H10W40/43 | PVGPATDIS, file of 2026-04-10 |
| H10F | Inorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation | H10F77/68 | PVGPATDIS, file of 2026-04-10 |
| Y02E | Reduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution | Y02E10/50 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2010-06-03 | Assignment Assignment of assignor's interest | HOCKADAY, ROBERT G. signed 2010-05-24 | ENERGY RELATED DEVICES, INC. LOS ALAMOS, NM | 24482/988 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.