Patents

US 8012262 B2: Process for steeping corn and steeping system therefore

Granted
2011-09-06
Filed
2009-06-08 application 12480241
Type
Utility · 14 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

The present invention is directed to improvements in the steeping process of corn wet milling and a steeping system therefore. The process for steeping corn includes subjecting corn situated in a battery of no less than four steeping tanks to a countercurrent flow of steep water. The first steeping tank defines a new corn receiving tank and the last steeping tank defines a discharge tank. The countercurrent flow of steep water includes sulfur dioxide and flows in a direction from the discharge tank to the new corn receiving tank. The sulfur dioxide concentration in the steep water of the first steeping tank is greater than the sulfur dioxide concentrations in a plurality of the remainder of the steeping tanks, which maintain sulfur dioxide levels that are substantially equivalent.

Source: PVGPATDIS, file of 2026-04-10 (ipg110906.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Fluid Quip, Inc. 15 patentsUS company or organizationSpringfield, OHPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Chie Ying LeeFremont, CA31Person page FUZZY medium confidencePVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
C08BPolysaccharides; derivatives thereofC08B30/044PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2022-03-10Assignment
Assignment of assignor's interest
FLUID QUIP, INC. signed 2021-12-30FLUID QUIP KS, LLC PEAPACK, NJ59221/646PASDL, file of 2026-10-15
2009-08-17Assignment
Assignment of assignor's interest
LEE, CHIE YING signed 2009-06-05FLUID-QUIP, INC. SPRINGFIELD, OH23106/708ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.