Patents

US 7937683 B1: Method and apparatus for configurable systems

Granted
2011-05-03
Filed
2008-04-30 application 12113200
Type
Utility · 18 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A configurable semiconductor chip module system has analog elements, digital elements, and connection elements between the analog and digital elements. Ones of the analog and digital elements receive inputs from respective sources, and ones of said analog and digital elements output signals for generating control signals having selected electrical and time spatial properties. The connection elements are configurable after creation of the analog elements, the digital elements, and the connection elements. A method of the invention for manufacturing a flexibly configurable semiconductor single chip module for receiving and outputting various signals not specifically known at the time of manufacture; manufactures a plurality of analog elements, digital elements, and connection elements between said analog and digital elements; enables ones of the analog and digital elements for receiving inputs from respective sources, ones of the analog and digital elements for outputting signals for controlling control signals having selected electrical and time spatial properties; and configures the connections elements after creation of the analog elements, the digital elements, and connection elements, to configure the module.

Source: PVGPATDIS, file of 2026-04-10 (ipg110503.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Innovations Holdings, L.L.C. 11 patentsUS company or organizationPennington, NJPVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Ewa HerbstEdgewater, NJ8PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
A61NElectrotherapy; magnetotherapy; radiation therapy; ultrasound therapyA61N1/32PVGPATDIS, file of 2026-04-10
H10DInorganic electric semiconductor devicesH10D89/10PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2015-07-06Name change
Change of address
INNOVATIONS HOLDINGS, L.L.C. signed 2015-06-16INNOVATIONS HOLDINGS, L.L.C. EDGEWATER, NJ36064/433ECORSEXC, file of 2026-09-25
2009-02-23Assignment
Assignment confirmation
HERBST, EWA signed 2009-01-17INNOVATIONS HOLDINGS, L.L.C. PENNINGTON, NJ22296/576ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.