Patents

US 7672140 B2: Circuit board configuration

Granted
2010-03-02
Filed
2008-01-22 application 12009895
Type
Utility · 21 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A circuit board configuration and method of packaging electronic component embedded into the circuit board in a manner that supports the electronic component thermally, electrically, and mechanically thereof, comprising a circuit board having a first surface and a circuit trace on the first surface; a recess or slot formed on the first surface defined by at least one sidewall that is oblique to the first surface of the circuit board; two or more plated surfaces on the at least one oblique sidewall and electrically connected to the circuit trace; and an electronic component having two or more electrical contact surfaces mounted to the two or more plated surfaces such that the electronic component is physically mounted to the oblique sidewall and in electrical communication with the circuit trace. The circuit board configuration may further comprise an encapsulant at least one end of the electronic component and a conductive material between the oblique sidewall and the electronic component to seal the electronic component inside the slot.

Source: PVGPATDIS, file of 2026-04-10 (ipg100302.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Tensolite LLC 8 patentsUS company or organizationSt. Augustine, FLTENSOLITE COMPANY State business registration FUZZY medium confidence: same name (legal endings aside) and statePVGPATDIS, file of 2026-04-10

Inventors

InventorPlacePatentsPerson pageSource
Bruce LaneTempe, AZ3PVGPATDIS, file of 2026-04-10

CPC categories

SubclassCategoryFirst groupSource
H05KPrinted circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical componentsH05K1/184PVGPATDIS, file of 2026-04-10

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2025-04-16Name change
Change of name
CARLISLE INTERCONNECT TECHNOLOGIES, INC. signed 2024-10-07AMPHENOL CABLE AND INTERCONNECT TECHNOLOGIES, INC. ST. AUGUSTINE, FL70867/688PASDL, file of 2026-10-15
2024-02-26Name change
Change of name
TENSOLITE COMPANY signed 2008-07-01TENSOLITE, LLC WILMINGTON, DE66679/317ECORSEXC, file of 2026-09-25
2015-04-28Assignment
Transfer of stock
TENSOLITE COMPANY signed 2008-06-30CARLISLE CONTAINER MANUFACTURING CORPORATION SAINT AUGUSTINE, FL35543/372ECORSEXC, file of 2026-09-25
2015-04-28Missing
Certificate of cancellation
TENSOLITE, LLC signed 2012-12-20CARLISLE INTERCONNECT TECHNOLOGIES, INC. SAINT AUGUSTINE, FL35526/125ECORSEXC, file of 2026-09-25
2015-04-28Name change
Change of name
CARLISLE CONTAINER MANUFACTURING CORPORATION signed 2011-08-05CARLISLE INTERCONNECT TECHNOLOGIES, INC. SAINT AUGUSTINE, FL35523/412ECORSEXC, file of 2026-09-25
2009-12-30Assignment
Assignment of assignor's interest
CONESYS, INC. signed 2009-09-17
JERRIK, INC. signed 2009-09-17
TENSOLITE, LLC SAINT AUGUSTINE, FL23716/285ECORSEXC, file of 2026-09-25
2008-01-22Assignment
Assignment of assignor's interest
LANE, BRUCE signed 2008-01-07CONESYS, INC. TORRANCE, CA20475/507ECORSEXC, file of 2026-09-25

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.