Patents
US 7378858 B2: Padé approximant based compensation for integrated sensor modules and the like
- Granted
- 2008-05-27
- Filed
- 2007-01-30 application 11700475
- Type
- Utility · 23 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
Methods and systems using Pade' Approximant expansion ratios provide mappings between nonlinear sensors and a more linearized output domain. In one embodiment (a) a variable gain amplifier receives a supplied input signal, the amplifier has at least a first input terminal, an output terminal, and a gain control terminal; (b) a first summer coupled to the output terminal of the variable gain amplifier adds in a first offset signal; (c) a first multiplier coupled to an output of the first summer receives a proportional feedback factor signal and correspondingly generates a multiplied feedback; (d) a second summer coupled to an output terminal of the first multiplier adds in a corresponding second offset signal; and (e) a second multiplier coupled to an output of the second summer receives a gain factor signal and generates a multiplied gain signal; where the gain control terminal of the variable gain amplifier is operatively coupled to an output terminal of the second multiplier.
Source: PVGPATDIS, file of 2026-04-10 (ipg080527.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| AMI Semiconductor, Inc. 2 patents | US company or organization | Pocatello, ID | PVGPATDIS, file of 2026-04-10 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Jose Marcos Laraia | Pocatello, ID | 4 | PVGPATDIS, file of 2026-04-10 | |
| Jose G. Taveira | Pocatello, ID | 3 | PVGPATDIS, file of 2026-04-10 | |
| Robert Moehrke | Pocatello, ID | 5 | PVGPATDIS, file of 2026-04-10 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| G01D | Measuring not specially adapted for a specific variable; arrangements for measuring two or more variables not covered in a single other subclass; tariff metering apparatus; measuring or testing not otherwise provided for | G01D3/028 | PVGPATDIS, file of 2026-04-10 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
| Recorded | What | From | To | Reel/frame | Source |
|---|---|---|---|---|---|
| 2023-06-22 | Release of security interest Release of security interest in patents recorded at reel 038620, frame 0087 | DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT signed 2023-06-22 | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC PHOENIX, AZ FAIRCHILD SEMICONDUCTOR CORPORATION PHOENIX, AZ | 64070/1 | PASDL, file of 2026-10-15 |
| 2016-08-25 | Correction Corrective assignment to correct the incorrect patent number 5859768 and to recite collateral agent role of receiving party in the security interest previously recorded on reel 038620 frame 0087. assignor(s) hereby confirms the security interest. | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC signed 2016-04-15 | DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT NEW YORK, NY | 39853/1 | PASDL, file of 2026-10-15 |
| 2016-05-06 | Release of security interest Release of security interest | JPMORGAN CHASE BANK, N.A. (ON ITS BEHALF AND ON BEHALF OF ITS PREDECESSOR IN INTEREST, CHASE MANHATTAN BANK) signed 2016-04-15 | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC PHOENIX, AZ | 38632/74 | PASDL, file of 2026-10-15 |
| 2016-05-06 | Release of security interest Release of security interest | JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT signed 2010-05-11 | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC PHOENIX, AZ | 38631/345 | PASDL, file of 2026-10-15 |
| 2016-04-15 | Security interest Security interest Security interest | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC signed 2016-04-15 | DEUTSCHE BANK AG NEW YORK BRANCH NEW YORK, NY | 38620/87 | PASDL, file of 2026-10-15 |
| 2009-09-25 | Security interest Security interest Purchase agreement dated 28 february 2009 | AMI SEMICONDUCTOR, INC. signed 2009-02-28 | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC PHOENIX, AZ | 23282/465 | ECORSEXC, file of 2026-09-25 |
| 2008-06-23 | Security interest Security interest Security agreement | AMI ACQUISITION LLC signed 2008-03-25 AMI SEMICONDUCTOR, INC. signed 2008-03-25 AMIS FOREIGN HOLDINGS INC. signed 2008-03-25 AMIS HOLDINGS, INC. signed 2008-03-25 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC signed 2008-03-25 | JPMORGAN CHASE BANK, N.A. NEW YORK, NY | 21138/70 | ECORSEXC, file of 2026-09-25 |
Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.