Patents
US 12772884 B2: Package comprising an integrated device and a metallization portion with variable thickness metallization interconnects on a same metal layer
- Granted
- 2026-10-20
- Filed
- 2023-09-01 application 18460471
- Type
- Utility · 14 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A package comprising an integrated device and a metallization portion. The metallization portion comprises at least one dielectric layer and a plurality of metallization interconnects. The plurality of metallization interconnects comprise a first metallization interconnect located on a first metal layer and a second metallization interconnect located on the first metal layer. The first metallization interconnect includes a first thickness. The second metallization interconnect includes a second thickness that is different from the first thickness. The package may include a substrate and/or a bridge. The substrate may include an interposer.
Source: PTBLXML, file of 2026-10-20 (ipgb20261020.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| QUALCOMM INCORPORATED 40,593 patents | US company or organization | San Diego, CA | PTBLXML, file of 2026-10-20 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Aniket Patil | San Diego, CA | 58 | PTBLXML, file of 2026-10-20 | |
| Brigham Navaja | San Diego, CA | 7 | PTBLXML, file of 2026-10-20 | |
| Hong Bok We | San Diego, CA | 91 | PTBLXML, file of 2026-10-20 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H10W | Generic packages, interconnections, connectors or other constructional details of devices covered by class h10 | H10W70/65 | PTBLXML, file of 2026-10-20 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
No recorded assignments or security interests on file for this patent.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.