Patents

US 12772821 B2: Memory cell structures using full backside connectivity

Granted
2026-10-20
Filed
2023-09-18 application 18469501
Type
Utility · 18 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

In an aspect, a semiconductor memory cell comprises gate structures separated by source or drain (S/D) structures, a frontside (FS) inter-layer dielectric (FS-ILD) layer above the gate and S/D structures, FS metal zero (FM0) interconnects above the FS-ILD layer, a backside (BS) inter-layer dielectric (BS-ILD) layer below the gate and S/D structures, BS metal zero (BM0) interconnects below the BS-ILD layer, at least one FS S/D contact (FSDC) electrically connecting an FM0 interconnect to a top surface of an S/D structure, and at least one BS S/D contact (BSDC) electrically connecting a BM0 interconnect to a bottom surface of an S/D structure. The semiconductor memory cell comprises NFETs and PFETs to form a cross-coupled inverter pair. For each inverter in the pair, one of VDD and VSS are provided by an FSDC and the other of VDD and VSS is provided by a BSDC.

Source: PTBLXML, file of 2026-10-20 (ipgb20261020.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Qualcomm Incorporated 40,593 patentsUS company or organizationSan Diego, CAPTBLXML, file of 2026-10-20

Inventors

InventorPlacePatentsPerson pageSource
Shreesh NarasimhaCharlotte, NCPTBLXML, file of 2026-10-20
Yan SunSan Diego, CAPTBLXML, file of 2026-10-20
Yandong GaoSan Diego, CA9PTBLXML, file of 2026-10-20
Peijie FengSan Diego, CA21PTBLXML, file of 2026-10-20

CPC categories

SubclassCategoryFirst groupSource
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10H10W20/20PTBLXML, file of 2026-10-20
H10BElectronic memory devicesH10B10/125PTBLXML, file of 2026-10-20
H10DInorganic electric semiconductor devicesH10D30/6729PTBLXML, file of 2026-10-20

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

No recorded assignments or security interests on file for this patent.

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