Patents
US 12772814 B2: Method of forming a metal liner for interconnect structures
- Granted
- 2026-10-20
- Filed
- 2023-04-07 application 18131956
- Type
- Utility · 15 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
Methods of forming devices comprise forming a dielectric layer on a substrate, the dielectric layer comprising at least one feature defining a gap including sidewalls and a bottom. The methods include selectively depositing a self-assembled monolayer (SAM) on the bottom of the gap. The SAM has a general formula I to XXIII, wherein R, R′, R1, R2, R3, R4, and R5 are independently selected from hydrogen (H), hydroxy, carbonyl, amino, aminoalkyl, alkyl, alkene, alkyne, and aryl, n is from 0 to 20, m is from 0 to 20, x is from 1 to 2, and y is from 1 to 2. A barrier layer is formed on the SAM before selectively depositing a metal liner on the barrier layer. The SAM is removed after selectively depositing the metal liner on the barrier layer.
Source: PTBLXML, file of 2026-10-20 (ipgb20261020.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Applied Materials, Inc. 9,683 patents | US company or organization | Santa Clara, CA | PTBLXML, file of 2026-10-20 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Jesus Candelario Mendoza-Gutierrez | San Jose, CA | PTBLXML, file of 2026-10-20 | ||
| Aaron Dangerfield | San Jose, CA | 11 | PTBLXML, file of 2026-10-20 | |
| Bhaskar Jyoti Bhuyan | San Jose, CA | 79 | PTBLXML, file of 2026-10-20 | |
| Mark Saly | Santa Clara, CA | 126 | PTBLXML, file of 2026-10-20 | |
| Yang Zhou | Milpitas, CA | PTBLXML, file of 2026-10-20 | ||
| Yong Jin Kim | Albany, CA | 218 | PTBLXML, file of 2026-10-20 | |
| Carmen Leal Cervantes | Mountain View, CA | 9 | PTBLXML, file of 2026-10-20 | |
| Ge Qu | Sunnyvale, CA | 5 | PTBLXML, file of 2026-10-20 | |
| Zhiyuan Wu | San Jose, CA | 35 | PTBLXML, file of 2026-10-20 | |
| Feng Chen | San Jose, CA | PTBLXML, file of 2026-10-20 | ||
| Kevin Kashefi | Santa Clara, CA | 28 | PTBLXML, file of 2026-10-20 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H10W | Generic packages, interconnections, connectors or other constructional details of devices covered by class h10 | H10W20/035 | PTBLXML, file of 2026-10-20 |
| C23C | Coating metallic material; coating material with metallic material; surface treatment of metallic material by diffusion into the surface, by chemical conversion or substitution; coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general | C23C16/04 | PTBLXML, file of 2026-10-20 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
No recorded assignments or security interests on file for this patent.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.