Patents
US 12772799 B2: Stress management for precise substrate-to-substrate bonding
- Granted
- 2026-10-20
- Filed
- 2024-02-02 application 18431860
- Type
- Utility · 20 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
Disclosed systems and techniques are directed to mitigating stresses in substrate-to-substrate bonding processes. Disclosed techniques include obtaining a first substrate supporting transferred feature(s) (TFs) and transferring TFs from the first substrate to a second substrate, transferring TFs from the first substrate to the second substrate, and applying stress mitigation to a target substrate. The target substrate can be the first substrate, an auxiliary substrate supporting TFs prior to transferring TFs from the auxiliary substrate to the first substrate, or the second substrate. Applying stress mitigation to the target substrate includes obtaining an out-of-plane deformation (OPD) profile of the target substrate, causing a stress compensation layer (SCL) to be deposited on the target substrate, and exposing the SCL to a stress-mitigation beam. Settings of the SCL and/or the stress-mitigation beam are determined using the OPD profile of the target substrate.
Source: PTBLXML, file of 2026-10-20 (ipgb20261020.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Applied Materials, Inc. 9,683 patents | US company or organization | Santa Clara, CA | PTBLXML, file of 2026-10-20 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| San-Kuei Lin | Los Gatos, CA | PTBLXML, file of 2026-10-20 | ||
| Pradeep Kumar Subrahmanyan | San Jose, CA | PTBLXML, file of 2026-10-20 | ||
| Wonjae Lee | Fremont, CA | PTBLXML, file of 2026-10-20 | ||
| Ramkumar Karur Shanmugam | Cupertino, CA | PTBLXML, file of 2026-10-20 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H10P | Generic processes or apparatus for the manufacture or treatment of devices covered by class h10 | H10P74/203 | PTBLXML, file of 2026-10-20 |
| C23C | Coating metallic material; coating material with metallic material; surface treatment of metallic material by diffusion into the surface, by chemical conversion or substitution; coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general | C23C14/48 | PTBLXML, file of 2026-10-20 |
| G01B | Measuring length, thickness or similar linear dimensions; measuring angles; measuring areas; measuring irregularities of surfaces or contours | G01B9/02095 | PTBLXML, file of 2026-10-20 |
| H10W | Generic packages, interconnections, connectors or other constructional details of devices covered by class h10 | H10W42/121 | PTBLXML, file of 2026-10-20 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
No recorded assignments or security interests on file for this patent.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.