Patents

US 12772766 B2: Substrate stress management using direct selective area processing

Granted
2026-10-20
Filed
2023-12-28 application 18399418
Type
Utility · 8 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A method may include providing a stress the substrate having a main surface, and forming a patterned stress compensation layer on the main surface, wherein the patterned stress compensation layer is formed by exposing the main surface to a processing beam while a movement of the ion beam with respect to the main surface takes place.

Source: PTBLXML, file of 2026-10-20 (ipgb20261020.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Applied Materials, Inc. 9,683 patentsUS company or organizationSanta Clara, CAPTBLXML, file of 2026-10-20

Inventors

InventorPlacePatentsPerson pageSource
Morgan EvansManchester, MA85PTBLXML, file of 2026-10-20

CPC categories

SubclassCategoryFirst groupSource
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h10H10P50/283PTBLXML, file of 2026-10-20
G05BControl or regulating systems in general; functional elements of such systems; monitoring or testing arrangements for such systems or elementsG05B19/4155PTBLXML, file of 2026-10-20
H01JElectric discharge tubes or discharge lampsH01J37/20PTBLXML, file of 2026-10-20

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

No recorded assignments or security interests on file for this patent.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.