Patents

US 12770840 B2: Electrostatic chuck assembly

Granted
2026-10-20
Filed
2022-10-26 application 17974088
Type
Utility · 19 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Examples of a substrate support assembly are provided herein. In some examples, the substrate support assembly has a ceramic electrostatic chuck having a first side configured to support a substrate and a second side opposite the first side, wherein the ceramic electrostatic chuck includes an electrode embedded in the ceramic electrostatic chuck. The substrate support assembly has a cooling plate disposed under the second side of the ceramic electrostatic chuck, wherein the cooling plate includes an inner portion separated from an outer portion. The substrate support assembly has a bond layer coupling the ceramic electrostatic chuck to the cooling plate, wherein the bond layer is of a first material in the outer portion of the cooling plate and of a second material in the inner portion of the cooling plate, and wherein the first material has a greater thermal conductivity than that of the second material.

Source: PTBLXML, file of 2026-10-20 (ipgb20261020.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Applied Materials, Inc. 9,683 patentsUS company or organizationSanta Clara, CAPTBLXML, file of 2026-10-20

Inventors

InventorPlacePatentsPerson pageSource
Jaeyong ChoSan Jose, CA23PTBLXML, file of 2026-10-20
Rajinder DhindsaPleasanton, CA178PTBLXML, file of 2026-10-20
Daniel Sang ByunCampbell, CA16PTBLXML, file of 2026-10-20
Vladimir KnyazikSanta Clara, CA24PTBLXML, file of 2026-10-20

CPC categories

SubclassCategoryFirst groupSource
H01JElectric discharge tubes or discharge lampsH01J37/32724PTBLXML, file of 2026-10-20
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h10H10P72/722PTBLXML, file of 2026-10-20

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

No recorded assignments or security interests on file for this patent.

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