Patents

US 12770828 B2: Multi-electrode source assembly for plasma processing

Granted
2026-10-20
Filed
2023-04-24 application 18138730
Type
Utility · 23 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Apparatus and methods for controlling the uniformity of a plasma formed using a radio frequency (RF) source power assembly that includes one or more resonant tuning circuits coupled to two or more electrodes disposed within a multi-electrode source assembly. Improved plasma uniformity control and reduced system cost are achieved by eliminating multiple RF generators and matches that power the multiple electrodes separately. Multiple frequencies may also be provided to multiple electrodes at the same time, which can include another cost savings when using a multi-frequency RF source assembly. Local plasma density and sheath voltage over a surface of a substrate are controlled with segmented electrodes disposed within the processing region of a plasma processing chamber. The ion flux and direction, as well as energetic electron flux towards the substrate, are controlled to address the plasma non-uniformity and global tilt during processing of a semiconductor substrate.

Source: PTBLXML, file of 2026-10-20 (ipgb20261020.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Applied Materials, Inc. 9,683 patentsUS company or organizationSanta Clara, CAPTBLXML, file of 2026-10-20

Inventors

InventorPlacePatentsPerson pageSource
Linying CuiCupertino, CA28PTBLXML, file of 2026-10-20
James RogersLos Gatos, CAPTBLXML, file of 2026-10-20
Rajinder DhindsaPleasanton, CA178PTBLXML, file of 2026-10-20

CPC categories

SubclassCategoryFirst groupSource
H01JElectric discharge tubes or discharge lampsH01J37/32183PTBLXML, file of 2026-10-20

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

No recorded assignments or security interests on file for this patent.

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