Patents

US 12769697 B1: Wireless connectivity architecture with tile radio frequency (RF) front-end circuitry

Granted
2026-10-20
Filed
2024-08-16 application 18807725
Type
Utility · 20 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Technologies related to wireless connectivity architectures with tile radio frequency (RF) integrated circuits are described. A wireless communication subsystem includes multiple RF tiles, each of the RF tiles including identical hardware comprising a first serializer/deserializer (SerDes) interface circuit and at least two radio frequency front-end (RFFE) circuits. Each of the at least two RFFE circuits corresponding to one of multiple radio technologies. The wireless communication subsystem includes multiple baseband processors. Each of the baseband processors implementing one of the radio technologies. The wireless communication subsystem also includes a second SerDes interface circuit coupled between the baseband processors and the first SerDes interface circuit of each of the RF tiles.

Source: PTBLXML, file of 2026-10-20 (ipgb20261020.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
AMAZON TECHNOLOGIES, INC. 23,285 patentsUS company or organizationSeattle, WAAMAZON TECHNOLOGIES INC. State business registration EXACT high confidence: identical full name and statePTBLXML, file of 2026-10-20

Inventors

InventorPlacePatentsPerson pageSource
Ravi IchapurapuMorgan Hill, CA31PTBLXML, file of 2026-10-20

CPC categories

SubclassCategoryFirst groupSource
G06FElectric digital data processingG06F13/4282PTBLXML, file of 2026-10-20
G06KGraphical data reading ; presentation of data; record carriers; handling record carriersG06K19/0723PTBLXML, file of 2026-10-20

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2024-08-19Assignment
Assignment of assignor's interest
ICHAPURAPU, RAVI signed 2024-08-16AMAZON TECHNOLOGIES, INC. SEATTLE, WA68323/793PASDL, file of 2026-10-23

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.