Patents

US 12768751 B2: System and method for estimating tire wear using acoustic footprint analysis

Granted
2026-10-20
Filed
2022-01-06 application 18266786
Type
Utility · 18 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Systems and methods are disclosed herein for estimating tire wear based on acoustic footprint analysis. Tire-mounted sensors provide signals corresponding to dynamic mechanical behavior of the tire, and a computing device graphically constructs spectra comprising time and frequency content of the signals and implements models comprising predetermined spectra associated with an unworn version of the tire for comparison with the graphically constructed spectra for a footprint region of the tire. Graphical features of the spectra associated with the footprint region of the tire are extracted as predefined indicators of stiffness change based on the comparison, wherein tire wear state is estimated based on the extracted graphical features. Exemplary graphical features may include high frequency energy signatures at the footprint region, signal damping signatures at a trailing edge of the footprint region, increased energy signatures in a tread passage frequency band at the footprint region, and the like.

Source: PTBLXML, file of 2026-10-20 (ipgb20261020.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Bridgestone Americas Tire Operations, LLC 637 patentsUS company or organizationNashville, TNPTBLXML, file of 2026-10-20

Inventors

InventorPlacePatentsPerson pageSource
Yousof AziziAkron, OH3PTBLXML, file of 2026-10-20
Thomas A. SamsAkron, OH17PTBLXML, file of 2026-10-20

CPC categories

SubclassCategoryFirst groupSource
G01MTesting static or dynamic balance of machines or structures; testing of structures or apparatus, not otherwise provided forG01M17/025PTBLXML, file of 2026-10-20

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

No recorded assignments or security interests on file for this patent.

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