Patents

US 12768010 B2: Production and use of composite graphene-copper powders

Granted
2026-10-20
Filed
2023-10-13 application 18486468
Type
Utility · 8 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

Systems, methods, and devices for forming and implementing a graphene-copper composite powder are disclosed. The graphene-copper composite powder may be formed by providing an inert environment, introducing a first mist to the inert environment, introducing a second mist to the inert environment, and mixing the first mist and the second mist within the inert environment to thereby produce a graphene-copper composite powder. The first mist being atomized copper with a negative charge, and the second mist including graphene flakes with a positive charge. The graphene-copper composite powder may be used to form components via additive manufacturing or traditional powder metallurgy processes.

Source: PTBLXML, file of 2026-10-20 (ipgb20261020.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
GM GLOBAL TECHNOLOGY OPERATIONS LLC 19,536 patentsUS company or organizationDetroit, MIPTBLXML, file of 2026-10-20

Inventors

InventorPlacePatentsPerson pageSource
Qigui WangRochester Hills, MI119PTBLXML, file of 2026-10-20
Yi LiuTroy, MI25PTBLXML, file of 2026-10-20
Ronald C. DaulNorthville, MI11PTBLXML, file of 2026-10-20
Ali ShabbirSterling Heights, MI14PTBLXML, file of 2026-10-20
Kestutis A. SontaTroy, MI17PTBLXML, file of 2026-10-20
Daniel J. WilsonLinden, MI47PTBLXML, file of 2026-10-20

CPC categories

SubclassCategoryFirst groupSource
C22CAlloysC22C1/1042PTBLXML, file of 2026-10-20
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sinteringB33Y80/00PTBLXML, file of 2026-10-20
C01BNon-metallic elements; compounds thereof; ; metalloids or compounds thereof not covered by subclass c01cC01B32/19PTBLXML, file of 2026-10-20

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

No recorded assignments or security interests on file for this patent.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.