Patents

US 12764970 B2: Cross-point magnetoresistive memory array containing carbon-based layer and method of making the same

Granted
2026-10-13
Filed
2023-08-01 application 18363542
Type
Utility · 15 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

A device structure includes first electrically conductive lines that are laterally spaced apart from each other, second electrically conductive lines that are vertically spaced apart from the first electrically conductive lines and are laterally spaced apart from each other, a two-dimensional array of magnetoresistive random access memory (MRAM) pillars located between the first electrically conductive lines and the second electrically conductive lines, and each of the MRAM pillars includes a respective reference layer, a respective nonmagnetic tunnel barrier layer, and a respective free layer, and a two-dimensional array of carbon-based layers contacting surfaces of the first electrically conductive lines and surfaces of the two-dimensional array of MRAM pillars.

Source: PTBLXML, file of 2026-10-13 (ipgb20261013.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Sandisk Technologies, Inc. 4,933 patentsUS company or organizationMilpitas, CASANDISK TECHNOLOGIES LLC State business registration FUZZY medium confidence: same name (legal endings aside) and statePTBLXML, file of 2026-10-13

Inventors

InventorPlacePatentsPerson pageSource
Jeffrey LilleSunnyvale, CAPTBLXML, file of 2026-10-13
Jordan KatineMountain View, CAPTBLXML, file of 2026-10-13
Tiffany SantosPalo Alto, CA10PTBLXML, file of 2026-10-13

CPC categories

SubclassCategoryFirst groupSource
H10BElectronic memory devicesH10B61/10PTBLXML, file of 2026-10-13

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

RecordedWhatFromToReel/frameSource
2025-04-25Release of security interest
Partial release of security interests
JPMORGAN CHASE BANK, N.A., AS AGENT signed 2025-04-24SANDISK TECHNOLOGIES, INC. MILPITAS, CA71382/1PASDL, file of 2026-10-15

Documents recorded with the USPTO Assignment Recordation Branch that list this patent. A security interest is a lender’s claim on the patent as collateral; a release ends it.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.