Patents

US 12761430 B2: Package structure having photonic integrated circuit

Granted
2026-10-13
Filed
2024-04-16 application 18636312
Type
Utility · 14 claims
Elsewhere
Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗

Abstract

The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.

Source: PTBLXML, file of 2026-10-13 (ipgb20261013.xml).

Assignees

AssigneeTypePlaceAlso on furp.orgSource
Molex, LLC 1,549 patentsUS company or organizationLisle, ILPTBLXML, file of 2026-10-13

Inventors

InventorPlacePatentsPerson pageSource
Chih-Chung HsuZhubei, TW22PTBLXML, file of 2026-10-13
Chih-Chung WuHsinchu, TW26PTBLXML, file of 2026-10-13
Zuon-Min ChuangTaoyuan, TW14PTBLXML, file of 2026-10-13
Chih-Wei PengHsinchu, TW5PTBLXML, file of 2026-10-13

CPC categories

SubclassCategoryFirst groupSource
G02BOptical elements, systems or apparatusG02B6/4245PTBLXML, file of 2026-10-13

Cooperative Patent Classification, as currently assigned (one row per subclass).

Assignments and security interests

No recorded assignments or security interests on file for this patent.

USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.