Patents
US 12757792 B2: Wafer-level hybrid bonded RF switch with redistribution layer
- Granted
- 2026-10-06
- Filed
- 2023-10-26 application 18384029
- Type
- Utility · 17 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
Embodiments of an IC device are disclosed. In some embodiments, an integrated circuit (IC) device, includes: an first active semiconductor layer that includes first active semiconductor device regions; a second active semiconductor layer that includes active semiconductor regions, the second active semiconductor layer being connected to the first active semiconductor layer and being positioned over the first active semiconductor layer; a first redistribution layer positioned over the second active conductor layer, the first redistribution layer is electrically connected to the first active semiconductor layer and the second active semiconductor layer; a passivation layer positioned on the first redistribution layer; a second redistribution layer positioned over the passivation layer, wherein the second redistribution layer is electrically connected to the first redistribution layer.
Source: PTBLXML, file of 2026-10-06 (ipgb20261006.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Qorvo US, Inc. 1,491 patents | US company or organization | Greensboro, NC | QORVO US, INC. Federal lobbying client EXACT high confidence: identical full name and state | PTBLXML, file of 2026-10-06 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Michael Carroll | Jamestown, NC | 114 | PTBLXML, file of 2026-10-06 | |
| Eric K. Bolton | Kernersville, NC | 15 | PTBLXML, file of 2026-10-06 | |
| Ma Shirley Asoy | High Point, NC | 3 | PTBLXML, file of 2026-10-06 | |
| Xi Luo | High Point, NC | PTBLXML, file of 2026-10-06 | ||
| Daniel Charles Kerr | Oak Ridge, NC | 43 | PTBLXML, file of 2026-10-06 | |
| Chi-Hsien Chiu | High Point, NC | PTBLXML, file of 2026-10-06 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H10W | Generic packages, interconnections, connectors or other constructional details of devices covered by class h10 | H10W90/00 | PTBLXML, file of 2026-10-06 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
No recorded assignments or security interests on file for this patent.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.