Patents
US 12756154 B2: Systems and methods for cooling high power devices
- Granted
- 2026-10-06
- Filed
- 2023-01-17 application 18155503
- Type
- Utility · 18 claims
- Elsewhere
- Google Patents ↗ · USPTO patent document ↗ · USPTO Patent Center record ↗
Abstract
A thermoelectric cooling (TEC) embedded electronics system having a substrate with a first surface and a second surface, and constructed of a thermally and electrically conductive material, and a die. The die is configured to be supported from the first surface of the substrate and in thermal contact with the substrate. The die forms a heat generating component. A TEC material element is used which has a first surface and a second surface and is configured to be positioned at least partially against the second surface of the substrate. A heat pipe is provided which has a first portion and a second portion. The first portion is configured to be in thermal contact with the second surface of the TEC material, and the second portion is configured to sink heat generated by the die and transmitted through the substrate and the TEC material element.
Source: PTBLXML, file of 2026-10-06 (ipgb20261006.xml).
Assignees
| Assignee | Type | Place | Also on furp.org | Source |
|---|---|---|---|---|
| Lawrence Livermore National Security, LLC 1,498 patents | US company or organization | Livermore, CA | LAWRENCE LIVERMORE NATIONAL SECURITY, LLC State business registration EXACT high confidence: identical full name and state | PTBLXML, file of 2026-10-06 |
Inventors
| Inventor | Place | Patents | Person page | Source |
|---|---|---|---|---|
| Susant K. Patra | Brentwood, CA | 25 | PTBLXML, file of 2026-10-06 | |
| Robert J. Deri | Pleasanton, CA | 22 | PTBLXML, file of 2026-10-06 |
CPC categories
| Subclass | Category | First group | Source |
|---|---|---|---|
| H01S | Devices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light; devices using stimulated emission of electromagnetic radiation in wave ranges other than optical | H01S5/02415 | PTBLXML, file of 2026-10-06 |
| H10N | Electric solid-state devices not otherwise provided for | H10N10/80 | PTBLXML, file of 2026-10-06 |
| H10W | Generic packages, interconnections, connectors or other constructional details of devices covered by class h10 | H10W40/28 | PTBLXML, file of 2026-10-06 |
Cooperative Patent Classification, as currently assigned (one row per subclass).
Assignments and security interests
No recorded assignments or security interests on file for this patent.
USPTO bulk data: PatentsView granted patents, disambiguated (PVGPATDIS) for patents, assignees, inventors, places and CPC categories; the USPTO Patent Assignment Dataset (ECORSEXC) for assignments and security interests. Patents filed in the last 20 years. No claims or full text. Links to other records are by name (and state): EXACT means the identical full name and state; FUZZY means a looser name match, with the confidence shown.